Chip, Package and Board Design

Menu

Complex 3D stacked structures and embedded devices

As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.

We can help you with

Advanced IC Packaging

Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.

System Level Circuit Engineering

Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.

3D Multi-Board PCB Design

You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.

Customer reference

Demonstration

Play 5:19 Play 1:30 Play 12:30 Play 0:56

Tell us more about your challenge

While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
Get in touch