Chip, Package and Board Design

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Complex 3D stacked structures and embedded devices

As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.

We can help you with

Advanced IC Packaging

Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.

System Level Circuit Engineering

Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.

3D Multi-Board PCB Design

You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.

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Demonstration

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More on Chip-package-board-co-design solutions

Check our latest webinars, white papers, blog posts and more

  • Press Release
June 16, 2020
CR-8000 2020

Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

Read now
FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
  • Blog
August 01, 2019
6 NEW Routing Enhancements in CR-8000 Design Force 2019

With every software release, you’ll find hundreds of enhancements, and CR-8000 Design Force 2019 is not an exception. Some are flashy and exciting, while others are, well, more utilitarian. But each and every one of them makes the product better. In this post, I’ll review my favorite 6 new routing enhancements in CR-8000 Design Force 2019.

Read now
  • Press Release
May 22, 2019
Zuken joins the UCLA CHIPS consortium
Press Release, Design Force Advanced Packaging
  • Blog
May 02, 2019
Shorter Design Cycles with Better ECAD-MCAD Collaboration

Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there.

Read now
  • Webinar
November 28, 2018
I/O Optimization with 3D SoC, SiP, and PCB co-design
Webinar, Chip-Package-Board Co-Design, Design Force, Design Force Advanced Packaging
  • White Paper
October 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Chip-Package-Board Co-Design, Design Force Advanced Packaging
Combine chips and boards in new configurations

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While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
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