Chip, Package and Board Design
Complex 3D stacked structures and embedded devices
As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.
We can help you with
Advanced IC Packaging
Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.
System Level Circuit Engineering
Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.
3D Multi-Board PCB Design
You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
More on Chip-package-board-co-design solutions
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Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
With every software release, you’ll find hundreds of enhancements, and CR-8000 Design Force 2019 is not an exception. Some are flashy and exciting, while others are, well, more utilitarian. But each and every one of them makes the product better. In this post, I’ll review my favorite 6 new routing enhancements in CR-8000 Design Force 2019.
Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there.
Related products and extensions
Graphical Pin Manager offers an effective FPGA / PCB co-design environment providing support for the latest devices offered by FPGA vendors
CR-8000 Design Force is the fastest, most effective PCB layout solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.