Enhanced System-level Engineering and Physical Design Efficiency in CR-8000 2020
Zuken unveils details of its latest advanced 3D multi-board electronic design environment
June 30, 2020 – Munich, Germany, and Westford, MA – Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable contributions from academic research institutions such as UCLA or Fraunhofer IIS, have also been incorporated into the release, particularly in the field of advanced packaging.
Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
- Design efficiency benefits from significant enhancements in the areas of schematic design, FPGA optimization, skew group routing, and support of back-drilled vias.
- System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and ANSYS
- The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.
Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base
“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base”, says Kazuhiro Kariya, Managing Director of Zuken Inc., Yokohama. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of 3rd party design tools that are reaching their limits.”
The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs. Many legacy design tools are facing growing limitations, both in terms of system-level design and technology support.
Zuken reveals details of release 2020 of its advanced 3D multi-board EDA environment CR-8000. Key development themes for CR-8000 2020 are: 'Superior Design Efficiency', 'System-Level Design and Embedded Verification' and 'Support for Advanced Packaging Technology'
CR-8000 is a System-Level PCB & IC Package Design software including 3D Multi-board, Analysis and MCAD Integration