Enterprise PCB Design Software

CR-8000 enables engineers to define and validate the architecture of new PCB designs at a functional level before starting the detailed design. They can describe different functional blocks or insert them from existing designs and define their interactions. This gives them a clear idea of how the components will work together.

System Planner

The system-level circuit design capability of CR-8000 allows designers to view and optimise the entire electronic system as a whole. With integrated simulation and analysis tools, they can evaluate the system’s performance, signal integrity, current distribution and thermal characteristics. This helps identify and correct potential problems early on to ensure design integrity. In addition, CR-8000 provides powerful design rule checks to ensure that the design meets the specific requirements and standards of different manufacturing sites. These rules are configurable and can cover various aspects such as electrical, mechanical and manufacturing requirements.

Design Gateway

With centrally managed design rule sets and constraints, CR-8000 enables significant time savings and helps avoid errors. This feature ensures that all design decisions and constraints can be set in one central location and automatically applied to the entire project. This increases productivity and minimises the risk of design errors, ultimately saving time and money.

Circuit DR Navi

CR-8000 facilitates the efficient processing of multiple PCB designs as a cohesive multi-board system within the confines of their mechanical enclosure. By combining 2D and 3D design views, CR-8000 provides designers with a comprehensive perspective on their multi-board design. Users can view the individual PCBs within the system in detail while visualising their interaction and impact on the entire system.

Design Force
ECAD MCAD Collaboration | STEP Data Exchange

Chip package and PCB co-design in CR-8000 enables the efficient creation and optimisation of the layout of System in Package (SiP), Package on Package (PoP) and Package in Package (PiP) assemblies. With CR-8000, designers can create and optimise the layout of these complex subassemblies in both 2D and 3D, taking into account the target board environment. By tightly integrating the chip package and PCB design, designers can improve the performance, signal integrity and thermal performance of the assemblies. They can optimise component placement, routing paths and interconnect paths to ensure optimal signal integrity and efficient power distribution.

Chip-Package-Board Co-Design
IC Package Design

Integrated library and design data management capability in CR-8000 provides comprehensive management and control of releases, revisions and configurations. With this functionality, users can track the entire lifecycle of their library and design data. They can create different versions, define releases for specific development stages and track changes to their designs. The central management of the data ensures that all team members always have access to the latest information and can work together on the designs.

DS-CR