A unified environment to handle chip scale packaging (CSP), multi-chip modules (MCMs), and system-inpackage (SiP)
IC Package Design Software
IC Package Design with CR-8000
Design Force offers an intuitive, integrated IC package design software for designing single and multi-die packages for wire-bond, flip-chip, and high-density advanced packaging. Designers can start designs with early prototype input of chip and package data from the library, reuse data from IC layout tools, and take advantage of parametric wizards to streamline the creation of the system.
Automatic ball assignment with the ability to optimize complex routing solutions
Feasibility studies with advanced fan-out/fan-in and autorouting features to optimize package layer count
2.5/3D stacking structures handled in any configuration: stacked, adjacent, interposers, with wire bond and flip chip packages
An intuitive IC package design software for single and multi-die packages
With the Design Force native 3D platform, designers can easily implement and manage dense interconnects for wire bond or flip chip packages, and incorporate embedded component technology for advanced packaging and module design
Flip-chip technology is commonly used for high I/O count designs. It greatly reduces inductance, allows high-speed signals, and possesses better heat conductivity properties.
An RDL (redistribution layer) is used to connect I/O pads to solder bumps. RDL congestion issues arise when a single layer in spite of manual routing is not enough to complete the routing for a sizable design due to sub-optimal I/O placement. Hence, in multiple die packaged systems for flip-chips, RDL routing is the key to packaging tradeoffs.
To achieve a high performance and low cost chip-package-board system, early feasibility analysis is a must to allow physical constraints to be coupled to electrical requirements. The physical constraints are used to minimize total wire-length of the RDL routes, whereas the electrical requirements are used to ensure accurate signal-power ratio, low power consumption, reduced inductance and lower thermal effects.
Designers can leverage a broad range interactive and automatic routing tools to reduce effort conducting fan-in/fan-out routing, automatic ball assignments on the package, and routing of the complete package.
Design Force includes an array of utilities and wizards to accurately define wire-bond profiles, bond pad placement, multi-die or bond-pad connections, managing the stacking of ICs with online design and manufacturing rule checks.
The typical design flow for a power module is in MCAD, where only structural analysis is possible. Moving to a new design flow using CR-8000 Design Force also allows for electrical analysis too. This webinar will demonstrate the features and benefits of this new design flow.
With every software release, you’ll find hundreds of enhancements, and CR-8000 Design Force 2019 is not an exception. Some are flashy and exciting, while others are, well, more utilitarian. But each and every one of them makes the product better. In this post, I’ll review my favorite 6 new routing enhancements in CR-8000 Design Force 2019.
Related CR-8000 Products
In addition to advanced PCB layout capabilities, Design Force provides chip, package and board co-design capabilities to enable real time 3D hierarchical design. This allows design teams to concurrently create any combination of advanced die stacks, packages and PCBs.
Graphical Pin Manager offers an effective FPGA / PCB co-design environment providing support for the latest devices offered by FPGA vendors
CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.