PCB Design in Context
Taking PCB CAD into the third dimension
For many years, the layout of a PCB in 2D has been sufficient for most mainstream technologies. Today’s requirements, including embedding passive and active components on inner layers and through-silicon-via (TSV) technologies, call for comprehensive 3D board design and visualization capabilities.
The need for 3D
Today’s requirements include embedding passive and active components on inner layers, inside a cavity, and within the dielectric of a board stack-up. The introduction of through-silicon-via (TSV) technology has further increased the complexity of designing a product using advanced packaging technologies. 2D CAD systems cannot manage these requirements intelligently and take into consideration the necessary manufacturing rules. A true 3D PCB design system allows users to design in 2D or 3D as needed to accurately design with the latest technology and respond to market demands in high-pressure business cycles.
Adressing the multiboard design challenge
With CR-8000, Zuken provides a solution that supports optimization of a design at both the product and PCB design level.
3D Multi-board PCB Design
Manage all of the boards in a system, and bring them together in one view. You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
Chip, Package and Board Co-Design
Product-centric detailed design includes 2D/3D multi-board design and implementation, FPGA I/O optimization, chip/package/board co-design, and 3D MCAD integration all in one design process.
3D ECAD/MCAD Collaboration
Import and export true 3D STEP models for components and enclosures and check for required clearance or collision to eliminate costly downstream ECAD / MCAD integration problems.
CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.
Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced packaging.
In addition to advanced PCB layout capabilities, Design Force provides chip, package, and board co-design capabilities to enable real-time 3D hierarchical design. This allows design teams to concurrently create any combination of advanced die stacks, packages, and PCBs.
Our satisfied customers
Flexible and flexi-rigid PCBs are integral components within many of Renishaw’s products, and detailed signal integrity analysis is needed to ensure high speed digital signals can be transmitted with minimal distortion. Renishaw migrated to Design Gateway and Design Force, part of Zuken’s CR-8000 PCB design suite, primarily to help with the design and analysis of next-generation flexible PCBs.
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.
More on 3D Multi-board PCB design solutions
Check our latest webinars, white papers, blog posts and more
With its support of 3D, CR-8000 Design Force offers the possibility of validating PCB designs against the mechanical envelope. In this session you will learn how to use formats such as IDX and JT in Design Force or, alternatively, how to import native 3D data from various MCAD systems.
CR-8000 Design Force 2021 offers a wealth of new features and improved functionality. Check out the top benefits for PCB Designers in the newest release.
In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.
Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
The benefits of developing all boards of a system concurrently on a single CAD canvas. Stacking PCBs, as opposed to connecting with cables, in multi-board design is a current and highly popular trend, as manufacturing costs are reduced and reliability improved.
DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.