PCB Design in Context
Taking PCB CAD into the third dimension
For many years, the layout of a PCB in 2D has been sufficient for most mainstream technologies. Today’s requirements, including embedding passive and active components on inner layers and through-silicon-via (TSV) technologies, call for comprehensive 3D board design and visualization capabilities.
The need for 3D
Today’s requirements include embedding passive and active components on inner layers, inside a cavity, and within the dielectric of a board stack-up. The introduction of through-silicon-via (TSV) technology has further increased the complexity of designing a product using advanced packaging technologies. 2D CAD systems cannot manage these requirements intelligently and take into consideration the necessary manufacturing rules. A true 3D system allows users to design in 2D or 3D as needed to accurately design with the latest technology and respond to market demands in high-pressure business cycles.
Adressing the multiboard design challenge
With CR-8000, Zuken provides a solution that supports optimization of a design at both the product and PCB design level.
3D Multi-board PCB Design
Manage all of the boards in a system, and bring them together in one view. You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
Chip, Package and Board Co-Design
Product-centric detailed design includes 2D/3D multi-board design and implementation, FPGA I/O optimization, chip/package/board co-design, and 3D MCAD integration all in one design process.
3D ECAD/MCAD Collaboration
Import and export true 3D STEP models for components and enclosures and check for required clearance or collision to eliminate costly downstream ECAD / MCAD integration problems.
Our satisfied customers
We can place components in a 3D environment, taking into account any constraints that may have come over from our mechanical engineers, and then switch back to 2D for routing.
Peter Leonard, Electronic Design Manager for Group Engineering
More on 3D Multi-board PCB design solutions
Check our latest webinars, white papers, blog posts and more
Les principaux thèmes de développement du CR-8000 2020 étaient l'efficacité supérieure de la conception, la conception et la vérification complètes au niveau du système, et le soutien des dernières avancées en matière de technologie de packaging des circuits intégrés.
DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.