System Level Design
A direct path from requirements to validated solutions
System engineering looks beyond the physical implementation of a product beginning with requirements that are evaluated and optimized on a system level before they are committed to detailed design. This is the stage where crucial design decisions are made that have a direct impact on product cost and behaviour.
Our design philolosophy therefore always starts at the system level, taking a design from concept to manufacturing in a seamless environment.
We can help you with
Product Architecture Optimization
System-level design tools for architectural planning enable engineers to optimize partitioning and performance electrical and electronica systems and maximize design reuse. Using this approach, we eliminate the need to re-enter planning data from 3rd party tools into the design tools during detailed design.
System Level Design and Analysis
Our design philosophy always starts at the system level, taking a design from concept to manufacturing in a seamless environment. Logical design and verification of electrical and electronic designs supports a true system-level circuit design in which individual circuits can be represented and connected as blocks.
Object Oriented Authoring Tools
Combining traditional 2D design with native 3D design and the latest human interface techniques, Zuken enables design teams to work in the context of a complete system or product. Designers can easily create any design from a prototype stage to a complex system within one single environment.
Related solutions and products
Vitech GENESYS is an integrated model-based systems engineering software toolset that covers all four domains of systems engineering — requirements, behavior, architecture, and verification and validation.
System Planner provides a system-level design environment for the architectural planning and optimization of electronic systems and products.
In addition to advanced PCB layout capabilities, Design Force provides chip, package, and board co-design capabilities to enable real-time 3D hierarchical design. This allows design teams to concurrently create any combination of advanced die stacks, packages, and PCBs.
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