Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.
Chip, Package and Board Design
Complex 3D stacked structures and embedded devices
As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.
We can help you with
Advanced IC Packaging
Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.
System Level Circuit Engineering
Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.
3D Multi-Board PCB Design
You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
More on Chip-package-board-co-design solutions
Check our latest webinars, white papers and more
The typical design flow for a power module is in MCAD, where only structural analysis is possible. Moving to a new design flow using CR-8000 Design Force also allows for electrical analysis too. This webinar will demonstrate the features and benefits of this new design flow.
CR-8000 advances system-level PCB design with significant enhancements in analog simulation, SI analysis, and intelligent layout and routing
Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
In this webinar the use of the Rule Stack Editor and Clearance Class in conjunction with the Constraint Browser will be explained step by step.
Related products and extensions
Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced packaging.
Graphical Pin Manager offers an effective FPGA / PCB co-design environment providing support for the latest devices offered by FPGA vendors
CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.
View all Chip-package-board-co-design blog posts
EREMS, a French enterprise specializing in the design and realization of high-tech electronic equipment and of associated software for Space, Defense, and Aeronautics uses CR-8000 and DS-CR from Zuken for the design and lifecycle management of flight electronics, ground electronic equipment, and test benches.
Zuken's Custom Development Group has developed a solution that enables simultaneous IC, connector, and PCB development by automating the updating of pin assignments in PCB design.
PDN impedance is becoming more and more of a headache for PCB designers as IC vendors are defining increasingly tight so-called ‘target impedance limits’. This article explains what PDN impedance means for PCB designers and what to pay particular attention to.
For many years, the layout of a printed circuit board in 2D was sufficient for most mainstream technologies. Today, however, product developers in the electronics industry are facing new challenges, triggered by megatrends such as the Internet of Things. Can today's CAD tools deliver on today's advanced requirements and harness the power of new technologies?