electronics

Chip, Package and Board Design

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Complex 3D stacked structures and embedded devices

As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.

Chip design software with concurrent co-design

We can help you with

Advanced IC Packaging

Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.

System Level Circuit Engineering

Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.

3D Multi-Board PCB Design

You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.

Customer reference

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More on Chip-package-board-co-design solutions

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View all Chip-package-board-co-design blog posts

  • Blog
octobre 07, 2021
Automatic Block Update: Automatically generate FPGA pin assignments in Design Gateway designs

Zuken's Custom Development Group has developed a solution that enables simultaneous IC, connector, and PCB development by automating the updating of pin assignments in PCB design.

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  • Blog
septembre 20, 2021
What PDN Target Impedance Means for PCB Designers

PDN impedance is becoming more and more of a headache for PCB designers as IC vendors are defining increasingly tight so-called ‘target impedance limits’. This article explains what PDN impedance means for PCB designers and what to pay particular attention to.

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  • Blog
juin 03, 2021
Is 3D Electronics Design keeping up with today's Trends?

For many years, the layout of a printed circuit board in 2D was sufficient for most mainstream technologies. Today, however, product developers in the electronics industry are facing new challenges, triggered by megatrends such as the Internet of Things. Can today's CAD tools deliver on today's advanced requirements and harness the power of new technologies?

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  • Blog
juin 30, 2020
CR-8000 2020 Supports Electronic Subsystem Design

CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool. CR-8000 2020 has all the bells and whistles for electronic subsystem development.

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