Chip, Package and Board Design
Complex 3D stacked structures and embedded devices
As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.
We can help you with
Advanced IC Packaging
Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.
System Level Circuit Engineering
Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.
3D Multi-Board PCB Design
You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
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Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.