Signal Integrity / power Integrity

Verification and Validation

Ensure that designs meet performance requirements

Embrace High Speed Design with Confidence

Many of today’s digital designs incorporate devices and technologies that require complex strategies to maintain signal integrity and reliability, where high-speed interfaces such as DDR and PCI Express impose specific timing demands that can no longer be resolved using traditional methods.

CR-8000 Design Gateway

We can help you with

Signal Integrity Analysis

Pre- and post-layout signal and power integrity toolsets that enable the engineer to organize, constrain, explore and analyze the design to minimize risk, reduce the number of prototypes and shorten development cycles.

EMI and Power Integrity Analysis

Fast and practical power integrity and electromagnetic interference analysis for EMI, AC and DC power analysis to determine the best decoupling and power distribution strategy.

Advanced Design Rule Checking

Zuken’s Advance Design Rule Management (ADM) system checks that designs are produced in accordance with component mounting and manufacturing specifications early in the design process, and concurrently as the work progresses.

Our satisfied customers

In the development of the world’s thinnest and lightest 20-inch large-screen 4K tablet, CR-8000 Design Force’s system-level SI and thermal analysis effectively reduced the number of design spins during the project. Due to the success of this project, we will make more efforts with Zuken to develop our next generation 4K tablet using CR-8000 Design Force.

Mr. Kiyoshi Nakanishi4K Tablet Development Manager, Panasonic

  • Case Study
October 09, 2018

Flexible and flexi-rigid PCBs are integral components within many of Renishaw’s products, and detailed signal integrity analysis is needed to ensure high speed digital signals can be transmitted with minimal distortion. Renishaw migrated to Design Gateway and Design Force, part of Zuken’s CR-8000 PCB design suite, primarily to help with the design and analysis of next-generation flexible PCBs.

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Better fit and impedance control for complex flexible PCBs in metrology instruments.
  • Case Study
October 09, 2018

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.

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significantly reduce product size with 3D chip, package, board co-design.

Recent Verification and Validation Blog Posts

  • Blog
July 11, 2019
How to Calculate Trace Length for High-speed Signals

To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. Let me take you through the process...

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  • Blog
June 13, 2019
Get to Know Your SPICEs

PCB designers typically have little or no experience with SPICE applications. No worries, follow along with me and get to know your SPICEs!

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  • Blog
February 28, 2019
Inside Signal Integrity: Impedance Control - Part 2

In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.

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  • Blog
February 21, 2019
Inside Signal Integrity: Impedance Control - Part 1

Impedance and impedance control are some of the oldest and most discussed topics in PCB design. They are especially important in high-speed design related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.

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  • Blog
August 16, 2018
What You Really Need to Know When You're Routing PCB Differential Pairs

Tips for when routing differential pairs - You can tell when something isn’t as clear as it should be. The same questions come up time and again. You ask three experts and get three different answers. Routing differential pairs can be like that. Why? Because “it depends” - on exactly what signals those pairs are carrying and what kind of PCB you’re creating.

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  • Blog
August 29, 2017
A Few Thoughts on Avoiding DDR4 Layout Problems

DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins.

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While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
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