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Embrace High Speed Design with Confidence

Many of today’s digital designs incorporate devices and technologies that require complex strategies to maintain signal integrity and reliability, where high-speed interfaces such as DDR and PCI Express impose specific timing demands that can no longer be resolved using traditional methods.

We can help you with

Signal Integrity Analysis

Pre- and post-layout signal and power integrity toolsets that enable the engineer to organize, constrain, explore and analyze the design to minimize risk, reduce the number of prototypes and shorten development cycles.

EMI and Power Integrity Analysis

Fast and practical power integrity and electromagnetic interference analysis for EMI, AC and DC power analysis to determine the best decoupling and power distribution strategy.

Advanced Design Rule Checking

Zuken’s Advance Design Rule Management (ADM) system checks that designs are produced in accordance with component mounting and manufacturing specifications early in the design process, and concurrently as the work progresses.

Our satisfied customers

In the development of the world’s thinnest and lightest 20-inch large-screen 4K tablet, CR-8000 Design Force’s system-level SI and thermal analysis effectively reduced the number of design spins during the project. Due to the success of this project, we will make more efforts with Zuken to develop our next generation 4K tablet using CR-8000 Design Force.

Mr. Kiyoshi Nakanishi4K Tablet Development Manager, Panasonic

  • Case Study
October 09, 2018
Renishaw

Flexible and flexi-rigid PCBs are integral components within many of Renishaw’s products, and detailed signal integrity analysis is needed to ensure high speed digital signals can be transmitted with minimal distortion. Renishaw migrated to Design Gateway and Design Force, part of Zuken’s CR-8000 PCB design suite, primarily to help with the design and analysis of next-generation flexible PCBs.

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Better fit and impedance control for complex flexible PCBs in metrology instruments.
  • Case Study
October 09, 2018
Toshiba

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.

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significantly reduce product size with 3D chip, package, board co-design.

More on 3D Multi-board PCB design solutions

Check our latest webinars, white papers, blog posts and more

  • Webinar
July 06, 2020
Practical Signal Integrity for improved EMI Control in PCB Design

In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.

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  • Webinar
November 15, 2019
How to be First to Market with DDR5!

DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.

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  • Blog
July 11, 2019
How to Calculate Trace Length from Time Delay Value for High-speed Signals

To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. Let me take you through the process...

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  • Blog
June 13, 2019
Get to Know Your SPICEs

PCB designers typically have little or no experience with SPICE applications. No worries, follow along with me and get to know your SPICEs!

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  • Blog
February 28, 2019
Inside Signal Integrity: Impedance Control - Part 2

In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.

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  • Blog
February 21, 2019
Inside Signal Integrity: Impedance Control - Part 1

Impedance and impedance control belong to the oldest and most often discussed topics in PCB design. They are especially important with the high-speed design when related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.

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Tell us more about your challenge

While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
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