Concurrent design of multiple PCBs and Chip-Packages in a single environment
3D Multi-Board PCB Design Software
3D design is becoming a critical need as the electrical and mechanical designs converge with little room for error
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CR-8000 Design Force
Design Force combines traditional 2D design with native 3D design and the latest human interface techniques, accelerated graphics and almost instantaneous rendering and refreshing. It is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout their designs in the context of a complete system or product.
Hierarchical multi-board design and system-level signal and design traceability
Single environment for high-speed design with constraint management and SI and PI analysis
Design to any manufacturing specification with built-in design for manufacturing (DFM) checks
With a native 2D and 3D architecture, designers can effectively co-design a chip, package and board to optimize I/Os at each level, embed components in the dielectric of a stack-up intelligently, and verify manufacturing rules in real-time. Concurrent design-for-manufacturing checks and constraint verification ensure that both manufacturing and engineering intent are maintained during the design process.
Take a look at CR-8000 Design Force
Design Force lets you manage multiple boards in one system, and bring them together in their physical environment.
Functionality Overview
Multiple PCBs in one environment
Design Force (3D multi-board pcb design software) combines traditional 2D design with native 3D design to support single board, multi-board and chip-package-board interconnect analysis and optimization.
System-level signal traceability
Design Force manages multiple boards in one system. Users can select from a combination of PCBs, packages and SoCs, and complete the layout of the design as a complete system.
Chip-Package-Board Co-design
Design Force is the industry’s only chip/package/board co-design solution in one tool. With Design Force, multi-board pcb design software, you can design and optimize your IC packaging design and never leave your PCB design.
High-speed design
Design Force supports advanced PCB layout tasks with sophisticated manual and automatic functionality that adheres to user definable sets of constraints. With integrated analysis tools, users can conduct signal integrity analysis concurrently during the physical layout.
Placement and Routing
Easy-to-use interactive placement and routing features and powerful autoplacement and autorouting capabilities boost productivity while automatically adhering to differentiated constraints to ensure manufacturability and signal as well as power integrity.
Built-in Analysis
Design Force allows access to embedded EMI and power integrity analysis, and supports integrations to best-in-class analysis solutions for disciplines such RF, Full-wave 3D signal integrity, power integrity, and thermal.
DFM Checks and Manufacturing Outputs
Design to any manufacturing specification during layout with built-in design for manufacturing (DFM) checks. Creation of panel designs, fabrication and assembly drawings, and CAM outputs.
Available Extensions
CR-8000 Design Force allows for a multitude of extensions to meet your specific design requirements
Advanced Design Rule Checking
Comprehensive checking of PCB manufacturability early in the design process.CR-8000 ADM (Advanced Design for Manufacture) facilitates checking that the design conforms to both manufacturing and component mounting specifications.
Advanced IC Packaging
As IC packaging architecture advances, Zuken’s Design Force enables the designer to deal with the growing complexity in design space in handling high pin-counts, high density designs and the need to interface with multiple formats and flows. Parametric wizards are available to define and optimize pin maps. A native 3D interface is available to deal with the various package architectures allowing for seamless co-design with chip and PCB designs. For feasibility studies, automatic fan-out and full routing features are available.
Chip-Package-Board Co-design
Zuken’s CR-8000 Design Force offers true co-design through a hierarchical setup wherein multiple designs can be brought together in the same framework. The connectivity between designs can be setup automatically or manually. The user is then able to move between designs (chip RDL, package or board or any combination thereof). This enables user to accurately see and edit the nets/routing on a system scale.
PCB-FPGA Co-Design
A powerful PCB-FPGA co-design environment that enables exchange of I/O and constraint information between PCB designs and FPGA designs.
Embedded SI Analysis and Topology Planning - Scenario EX
Scenario EX enables to check the electrical characteristics and the connection topology of signal tracks. It allows “What-If Scenarios” of both schematic and layout data to optimize the behaviour of a circuit. It can be used both for interactive design and design verification. It can be used stand alone or embedded into Design Force (Design Force SI)
Signal Integrity, Power Integrity and EMC Simulation
CR-8000 includes fully integrated simulation and analysis tools to verify all aspects of your single or multi-board designs including:
- Signal Integrity
- Power Integrity
- Electromagnetic Compatibility
Current Density Check
Fast and easy check of the current density of a layout structure towards a given maximum.
Multi-instance Interactive and Automatic Routing
Advanced interactive and automatic routing. Specify multiple instances of strategy-driven areas and simultaneously autoroute the design.
Sharing and Reviewing Design Data
Board Viewer – free design viewer
Board Viewer allows users to share and review native Design Force data to enhance communication during product development.
Board Viewer Advance
An enhanced viewing tool for sharing and reviewing Design Force design information including component property viewing (query), cross-probing with schematics; Design Rule Checks and manufacturing rule checks; graphical comparison of boards.
ECAD/MCAD Collaboration
3D product visualization is becoming a critical need as the electrical and mechanical designs converge with little room for error. Many companies cite ECAD / MCAD design synchronization as a significant product design challenge. Traditional 2D PCB-centric design cannot meet the needs of a 3D multi-discipline product design process.
PI/EMI Analysis Module
A simulation environment for Power Integrity (AC impedance and de-coupling impact, DC voltage drop, current analysis) and electro-magnetic interference (EMI full board screening, differential mode, common mode, power bus noise).
DFM Elements
Creation of panel designs, fabrication and assembly drawings, and CAM outputs.
Related Resources
Find out more about CR-8000 Design Force via our webinars, blogs, press releases and more...
- Press Release
juin 16, 2020
CR-8000 2020
Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
Read now
Updates to CR-8000, advanced 3D multi-board electronic design environment
- White Paper
octobre 20, 2018
Designing Products, Not Just Boards
White Paper, Design Force
The benefits of product-centric design and how it differs from current-generation PCB-centric processes and tools.
- White Paper
octobre 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Chip-Package-Board Co-Design, Design Force Advanced Packaging
Combine chips and boards in new configurations
- Press Release
août 21, 2018
Polar Speedstack PCB Stackup Interface
Press Release, Design Force, DFM Center, Design Force Advanced Packaging
- Press Release
juillet 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Chip-Package-Board Co-Design, DFM Center
- Press Release
avril 05, 2017
PCB Design to Manufacture for 3D Printing
Press Release, Design Force, 3D Printing
CR-8000 Design Force Webinars
- Webinar
novembre 15, 2019
How to be First to Market with DDR5!
DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.
WATCH NOW
- Webinar
avril 25, 2019
Practical Signal Integrity for improved EMI Control in PCB Design
The fast signal switching times of today’s digital systems require particular attention to the signal integrity during design to ensure reliable operation and EMI control
WATCH NOW
- Webinar
novembre 28, 2018
Design PCBs using an engineering knowledge base
Repeating the same mistakes, missing key requirements, and failure to follow design guidelines all cost time and money. An engineering knowledge base that is tightly integrated with the PCB design process can be a key differentiator for your design team.
WATCH NOW
- Webinar
novembre 28, 2018
Electro-Magnetic Compatibility (EMC) Design Basics
Webinar, Design Force
- Webinar
novembre 28, 2018
I/O Optimization with 3D SoC, SiP, and PCB co-design
Webinar, Chip-Package-Board Co-Design, Design Force, Design Force Advanced Packaging
- Webinar
octobre 22, 2018
Avoid PCB and Enclosure Collisions with 3D Product Visualization
Webinar, Design Force