3D Multi-Board PCB Design

Design Force combines traditional 2D design with native 3D design to support single board, multi-board and chip-package-board interconnect analysis and optimization.

Design Force manages multiple boards in one system. Users can select from a combination of PCBs, packages and SoCs, and complete the layout of the design as a complete system.

Design Force is the industry’s only chip/package/board co-design solution in one tool. With Design Force, you can design and optimize your IC packaging design and never leave your PCB design.

Design Force supports advanced PCB layout tasks with sophisticated manual and automatic functionality that adheres to user definable sets of constraints.  With integrated analysis tools, users can conduct signal integrity analysis concurrently during the physical layout.

Easy-to-use interactive placement and routing features and powerful autoplacement and autorouting capabilities boost productivity while automatically adhering to differentiated constraints to ensure manufacturability and signal as well as power integrity.

Design Force allows access to embedded EMI and power integrity analysis, and supports integrations to best-in-class analysis solutions for disciplines such RF, Full-wave 3D signal integrity, power integrity, and thermal.

Design to any manufacturing specification during layout with built-in design for manufacturing (DFM) checks. Creation of panel designs, fabrication and assembly drawings, and CAM outputs.

Comprehensive checking of PCB manufacturability early in the design process.CR-8000 ADM (Advanced Design for Manufacture) facilitates checking that the design conforms to both manufacturing and component mounting specifications.

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As IC packaging architecture advances, Zuken’s Design Force enables the designer to deal with the growing complexity in design space in handling high pin-counts, high density designs and the need to interface with multiple formats and flows. Parametric wizards are available to define and optimize pin maps. A native 3D interface is available to deal with the various package architectures allowing for seamless co-design with chip and PCB designs. For feasibility studies, automatic fan-out and full routing features are available.

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Zuken’s CR-8000 Design Force offers true co-design through a hierarchical setup wherein multiple designs can be brought together in the same framework. The connectivity between designs can be setup automatically or manually. The user is then able to move between designs (chip RDL, package or board or any combination thereof). This enables user to accurately see and edit the nets/routing on a system scale.

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A powerful PCB-FPGA co-design environment that enables exchange of I/O and constraint information between PCB designs and FPGA designs.

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Scenario EX enables to check the electrical characteristics and the connection topology of signal tracks. It allows “What-If Scenarios” of both schematic and layout data to optimize the behaviour of a circuit. It can be used both for interactive design and design verification. It can be used stand alone or embedded into Design Force (Design Force SI)

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CR-8000 includes fully integrated simulation and analysis tools to verify all aspects of your single or multi-board designs including:

• Signal Integrity
• Power Integrity
• Electromagnetic Compatibility

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Fast and easy check of the current density of a layout structure towards a given maximum.

Advanced interactive and automatic routing. Specify multiple instances of strategy-driven areas and simultaneously autoroute the design.

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Board Viewer – free design viewer 

Board Viewer allows users to share and review native Design Force data to enhance communication during product development.

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Board Viewer Avance

A enhanced viewing tool for sharing and reviewing Design Force design information including component property viewing (query), cross-probing with schematics; Design Rule Checks and manufacturing rule checks; graphical comparison of boards.

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3D product visualization is becoming a critical need as the electrical and mechanical designs converge with little room for error. Many companies cite ECAD / MCAD design synchronization as a significant product design challenge. Traditional 2D PCB-centric design cannot meet the needs of a 3D multi-discipline product design process.

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A simulation environment for Power Integrity (AC impedance and de-coupling impact, DC voltage drop, current analysis) and electro-magnetic interference (EMI full board screening, differential mode, common mode, power bus noise).

Creation of panel designs, fabrication and assembly drawings, and CAM outputs.

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