Chip, Package and Board Design
Complex 3D stacked structures and embedded devices
As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.
We can help you with
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Advanced IC Packaging
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Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.
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System Level Circuit Engineering
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Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.
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3D Multi-Board PCB Design
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You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.
Demonstration
More on Chip-package-board-co-design solutions
Check our latest webinars, white papers, blog posts and more
- Press Release
May 22, 2019
Zuken joins the UCLA CHIPS consortium
Press Release, Design Force Advanced Packaging
- On-Demand Webinar
November 28, 2018
I/O Optimization with 3D SoC, SiP, and PCB co-design
On-Demand Webinar, Chip-Package-Board Co-Design, Design Force
- White Paper
October 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Programmable Logic
Combine chips and boards in new configurations
- Press Release
August 21, 2018
Polar Speedstack PCB Stackup Interface
Press Release, Design Force, DFM Center, Design Force Advanced Packaging
- Press Release
July 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Chip-Package-Board Co-Design, DFM Center
Related products and extensions
- Products
January 03, 2019
Design Force Advanced Packaging
Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced packaging. Designers can start designs with early prototype input of chip and package data from the library, reuse data from IC layout tools, and take advantage of parametric wizards to streamline the creation of the system
Read now
IC Package and PCB Co-design
- Solutions
October 15, 2018
Chip, Package and Board Design
Complex stacked structures and embedded devices
- Products
November 19, 2018
Graphical Pin Manager
FPGA Pin Optimization
- Products
October 01, 2018
Design Force
Design Force combines traditional 2D design with native 3D design and the latest human interface techniques, accelerated graphics and almost instantaneous rendering and refreshing. It is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout their designs in the context of a complete system or product.
Read now
3D Multi-board PCB Design
Tell us more about your challenge
While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business.
Drop us a line and describe your challenge.
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