Stay ahead of the curve
Industry 4.0, the Internet of Things, Model Based System Engineering, and a sustained speed of innovation in the hardeware domain are profoundly changing the way products are engineered, manufactured and used. We help our customers to secure a competitive edge by consistently keeping our solutions ahead of the curve and anticipating future requirements.
Discover our contributions
- Solutions
octobre 15, 2018
MBSE
Up-front planning for tomorrow's complex designs
- Solutions
octobre 15, 2018
Industry 4.0
Respond to the challenges of digitization
- Solutions
octobre 15, 2018
Digital Twin
Adding connectivity to the Digital Twin
- Solutions
octobre 15, 2018
Printed Electronics
Working with industry leaders to enable new applications
- Solutions
octobre 15, 2018
AI/AR and Machine Learning
New opportunities for early adopters
- Solutions
octobre 15, 2018
Chip, Package and Board Design
Complex stacked structures and embedded devices
Related resources
Just some examples of how Zuken relates to emerging technologies
- Case Study
janvier 14, 2020
Electroflight
As part of the Accelerating the Electrification of Flight (ACCEL) research initiative, Electroflight is aiming to set a new world speed record of more than 300mph for an all-electric aircraft, involving the creation of one of the most power dense flying battery packs in the world.
Read now
- Press Release
octobre 17, 2018
E3.series for all-electric aircraft research initiative
Press Release, Wire Harness Engineering, Assurer la réactivité de l’entreprise, by Emerging Technologies, Manufacturing and Service Documentation
- Press Release
avril 05, 2017
PCB Design to Manufacture for 3D Printing
Press Release, Design Force, 3D Printing
- Press Release
avril 01, 2015
PCB Reference Designs for Intel IoT Devices
Press Release, Design Force, Industry 4.0
- Press Release
décembre 19, 2014
Innovation Award for Electric Vehicle Research
Press Release, Automotive