PCB Design in Context

Taking PCB CAD into the third dimension

For many years, the layout of a PCB in 2D has been sufficient for most mainstream technologies. Today’s requirements, including embedding passive and active components on inner layers and through-silicon-via (TSV) technologies, call for comprehensive 3D board design and visualization capabilities.

CR-8000 Design Force ECAD MCAD Multi system

The need for 3D

Today’s requirements include embedding passive and active components on inner layers, inside a cavity, and within the dielectric of a board stack-up. The introduction of through-silicon-via (TSV) technology has further increased the complexity of designing a product using advanced packaging technologies. 2D CAD systems cannot manage these requirements intelligently and take into consideration the necessary manufacturing rules. A true 3D system allows users to design in 2D or 3D as needed to accurately design with the latest technology and respond to market demands in high-pressure business cycles.

Adressing the multiboard design challenge

With CR-8000, Zuken provides a solution that supports optimization of a design at both the product and PCB design level.

3D Multi-board PCB Design

Manage all of the boards in a system, and bring them together in one view. You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.

Chip, Package and Board Co-Design

Product-centric detailed design includes 2D/3D multi-board design and implementation, FPGA I/O optimization, chip/package/board co-design, and 3D MCAD integration all in one design process.

3D ECAD/MCAD Collaboration

Import and export true 3D STEP models for components and enclosures and check for required clearance or collision to eliminate costly downstream ECAD / MCAD integration problems.

Our satisfied customers

We can place components in a 3D environment, taking into account any constraints that may have come over from our mechanical engineers, and then switch back to 2D for routing.

Peter Leonard, Electronic Design Manager for Group Engineering

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While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
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