High-speed PCB Design
Die PDN-Impedanz bereitet Leiterplattendesignern zunehmend Kopfzerbrechen, da die IC-Hersteller immer engere so genannte "Zielimpedanzgrenzen" festlegen. Dieser Artikel erklärt, was die PDN-Impedanz für Leiterplattendesigner bedeutet und worauf sie besonders achten sollten.
What drives the features that are added or updated in a new release? The majority of the changes or additions in any Zuken tool release are customer-driven. Our customers provide valuable insight into emerging technologies, process and methodology changes, and the direction in which their EDA needs are taking them. This post focuses on the high points of the CR-8000 2020 release.
Double Data Rate 5 (DDR5) is the next-generation standard for random-access memory (RAM). The new specification promises to bring chips that have much higher performance than the existing DDR4 modules, as well as lower power consumption. Let us show you how you can be first to market with DDR5!
To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. Let me take you through the process...
What IC designers do to help us route high-speed PCBs
PCB designers typically have little or no experience with SPICE applications. No worries, follow along with me and get to know your SPICEs!
In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.
Impedance and impedance control belong to the oldest and most often discussed topics in PCB design. They are especially important with the high-speed design when related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.
It’s not often you spend your work day laughing AND learning. But that’s how it went for Zuken Europe’s first foray into filming videos with our customers.
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
Tips for when routing differential pairs - You can tell when something isn’t as clear as it should be. The same questions come up time and again. You ask three experts and get three different answers. Routing differential pairs can be like that. Why? Because “it depends” - on exactly what signals those pairs are carrying and what kind of PCB you’re creating.
Do you still use Post-it Notes? Invented in 1979, this simple, yet incredibly powerful, communication mechanism is still commonly found in engineering and design departments. Despite modern electronic communication, many companies still struggle to provide a replacement for their ease-of-use and versatility.
It’s 25 years since the first FED Conference took place in Berlin back in 1993, as a gathering for the German-speaking electronic and PCB-related industry. This also happened to be the year we consider as the birth of high-speed design.
DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins.
In the final installment of this blog series, you can learn how to use build-up layers and premium FPGAs to deal with the signal integrity challenges arising from high-speed signals in a 3D design capture world.
This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and growing adoption of PCB design environments to design in true 3-D. Today I focus on vias and the use of return vias to overcome the issues highlighted in Part 1.