Strengthen high-speed design quality early to avoid rework and achieve reliable layouts without added workflow complexity.
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Advanced 3D EMC Design Rule Checks
Designing reliable high-speed electronics starts with layouts that support clean signals, stable power, and controlled emissions. As data rates rise and boards become more compact, even small routing decisions can turn into EMC failures or SI/PI violations during testing. EMC Adviser EX gives you a fast, rule-driven way to catch these issues early. It scans your design for the layout patterns that create emissions, degrade signal quality, or reduce power integrity. You get practical insight right on the canvas, without heavy setup or long simulation loops. This helps you build stronger boards and avoid late design surprises.
Apply unified SI/PI/EMC rules to reveal routing, layer transitions, and PDN choices that drive jitter, noise, or radiation.
Detect EMC-critical issues like parasitic antennas, broken return paths, impedance shifts, and high-coupling geometries.
A clear view of layout risks early in the design
EMC Adviser EX analyzes your design for issues like parasitic antennas, shielding gaps, broken return paths, impedance changes, and high-coupling geometries. These checks help you catch the structures that create emissions, introduce jitter, and reduce noise margins as data rates increase.
The rule set spans SI, PI, and EMC concerns, giving you a clear view of layout risks early in the design. By identifying routing patterns, layer transitions, and power-distribution choices that cause unwanted radiation or signal degradation, the tool helps you build cleaner, more robust high-speed designs without adding complexity to your workflow
Beyond Emissions: Immunity Checks for Electromechanical Susceptibility Risks
New rules for radiation immunity and stable ground connectivity extend the 3D EMC Advisor beyond emission-focused analysis by revealing how external fields and grounding structures interact with the PCB inside its mechanical enclosure.
By visualizing radiation intrusion, ground-path behavior, and the electromechanical conditions that increase susceptibility, the tool provides early insight into immunity risks that traditional analysis flows do not expose.
EMC Analysis Built on True 3D Context
EMC Adviser EX delivers analysis that reaches beyond traditional PCB checks by combining electrical behavior with the 3D mechanical context of the product. It identifies parasitic structures, shielding gaps, return-path issues, as well as susceptibility risks driven by external fields and grounding choices. These electromechanical insights appear directly in the layout environment, so teams can validate countermeasures, adjust enclosure features, and refine routing without relying on external solvers or complex model preparation. The result is a clearer view of EMC performance earlier in the design process, allowing
Rule categories and checks
Parasitic antenna checks identify routing and copper geometries that unintentionally radiate at high frequencies, helping prevent emissions issues early in the layout process.
- Detection of long, unterminated or branching traces
- Identification of large loop areas that behave as radiating structures
- Evaluation of copper shapes that form unintended dipoles
- Assessment of layout features likely to create high-frequency radiation
Shielding analysis and rule checks assess the quality and continuity of shielding throughout the design, helping prevent coupling, emissions, and noise intrusion.
- Shielded-signal coverage evaluation
- Vertical (Z-axis) shielding verification
- Four-direction shielding completeness
- Shield continuity across vias
- Shielding coverage for defined net groups
- Ground coverage assessment beneath components
- Protection against external noise sources
Return-path checks verify that high-speed signals use a continuous, low-inductance return path across all layers and boards.
- Return-path proximity evaluation for high-speed signals
- Detection of high via-density areas and anti-pad–induced cutouts or gaps
- Verification of unique reference signals assigned to critical nets
- Low-inductance return-path assessment across multi-board connections
Signal integrity checks evaluate the physical conditions that affect impedance, reflections, timing, and differential-pair quality in high-speed nets.
- Impedance mismatch detection on critical signals
- Termination requirement assessment for high-speed nets
- Identification of 90-degree routing corners
- Line-length checks against critical thresholds
- Differential-pair routing quality evaluation
- Track capacitance analysis and maximum capacitive load verification
Crosstalk checks identify routing and PDN conditions that increase unwanted coupling between signals and power nets, on single and multi-board systems.
- Crosstalk evaluation between active and passive signals
- Crosstalk evaluation between active signals and power nets
- Effectiveness assessment of EMC components in reducing coupling
- Proximity check of ground-prohibited signals to ground nets (same or adjacent layers)
- Noise-coupling assessment between multiple boards (multiboard)
Power integrity checks verify stable power delivery by evaluating decoupling placement, PDN geometry, connector interfaces, and current-carrying paths.
- Decoupling-capacitor placement assessment relative to IC power pins
- Detection of overlapping power planes that create noise-coupling bridges
- Identification of connectors impacted by high-speed routing over gaps
- Detection of high-speed traces routed near power-net vias connected to connectors
- Verification of track width and via count between power-related pin pairs
- Evaluation of connection-path length and effectiveness of ESD protection components
EMC Adviser EX can be launched from these products
- Products
October 01, 2018
Design Force
CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.
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3D Multi-board PCB Design
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Design Force Advanced Packaging
Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced IC packaging.
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IC Package and PCB Co-design
Further reading
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August 19, 2025
High‑Speed Serial Link Design: The TWO Things That Make Links Work (and Fail)
Learn the two key fundamentals for reliable high-speed serial link design and how to overcome signal integrity challenges at multi-Gbps speeds.
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Guest author: Donald Telian (SI Guys) – Signal‑integrity veteran, IBIS co‑founder, and author of Signal Integrity, In Practice.
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April 08, 2021
EMC for PCB design: anything but black magic
EMC problems are often responsible for re-design cycles in PCB design practice. Due to ever shorter innovation cycles of for example cell phones or IoT applications, such as fitness trackers or smartwatches, and many other electronic products, these time-consuming re-design cycles should be avoided under all circumstances.
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- Blog
February 28, 2019
Inside Signal Integrity: Impedance Control - Part 2
In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.
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