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System design can be complicated and difficult to track across the entire design. Blocks inside Zuken E3.series give the users an easy way to manage multiple systems of varying complexity in a seamless environment.
Using the Context Menu will increase your design speed and make E3.series easier to use. The video below explains how to use and add your most popular commands to the Context Menu.
I don’t think I’m generalizing when I say that designers working on complex high speed designs really don’t want to expend a lot of time and effort dealing with power integrity problems. And they especially don’t want to do it using tools that are detached from their design flow. In today’s complex PCBs, we’re talking advanced processors, complex FPGAs and superfast memories, which all share various voltage ranges.
This video walks through the process of creating connections that span more than one page in E3.series. This process comes in handy if your schematic sheet gets too crowded or your signal continues to another part of the schematic.
This will make E3.series easier to use and work faster by creating your own toolbars and keyboard shortcuts with the commands that you use most.
More often than not, our customers are less interested in the core functionality of the software than the goals and objectives they need to achieve when using it. These are usually product development projects with deadlines, cost and performance targets, alongside project management and coordination efforts.
CR-8000 Design Force 2017 has improved the offset via function by adding efficiency in pulling out tracks from vias, creating BGA designs and build-up designs. The controls are based on the following...
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs.
One of the more powerful capabilities of a good data management system such as DS-CR (formerly known as DS-2) is searching and the ability to generate reports. A great example is the ability to generate Where-used information. These types of reports are extremely useful when performing impact assessments where ...
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity.
The customization and workspace flexibility is one more way for E3.series to give the user what they need and want. All workspace customizations can be saved locally to provide a consistent user interface.
We are all looking to gain productivity in our design cycle to save time and reduce costs. A good method to get a head start is to use Excel or a .csv file to get the design started and load devices into you project. The most common application is to load the connectors and signals from Printed Circuit Board (PCB) in the electrical design. Blocks can be used to represent systems and the Excel sheet can help you get the system information from other teams or 3rd party vendors.
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
E3.series with the shared sheet option for panels and formboard/nailboard makes it easy to design a large system and we will be looking at the quick steps needed to get started.
E3.series 2017 brings improved automatic routing for making connections by adding automatic connections between selected items. The most common controls are based on the following scenarios ...