Design Reuse
- Blog
September 06, 2023
Die Vorteile der Wiederverwendung von PCB-Designs mit CR-8000 nutzen
Mit dem Release 2023 von CR-8000 wird der Aufwand für die Wiederverwendung bestehender Designs im Engineering-Frontend Design Gateway sowie in den Layout- und Routing-Anwendungen von Design Force erheblich reduziert.
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- Blog
Mai 16, 2022
ECAD Datenmigration oder Datenkonvertierung?
Elektrische und elektronische Entwicklungs- und Konstruktionsdaten stellen eine wertvolle Investition dar, die es gilt, so oft wie möglich zu nutzen und wiederzuverwenden. Um vorhandene Designdaten über den gesamten Produktlebenszyklus hinweg zu sichern, werden über den Lebenszyklus von hochwertigen Produkten immer wieder die Anforderung bestehen, die ursprünglichen Designdaten für ein moderneres und leistungsfähigeres ECAD-Tool aufzubereiten .Erfahren Sie mehr über den Unterschied zwischen Datenmigration und Datenkonvertierung und finden Sie heraus, welche Lösung für Ihr Unternehmen die richtige ist.
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- Blog
April 21, 2020
Legacy Data Management and Migration with CR-8000
In today’s global value chains, data exchange and re-reuse are vital to support collaboration and productivity. But most data formats are proprietary. For any organization with an extensive database of ECAD data, the need for data migration will eventually arise.
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- Blog
Januar 18, 2018
Four Steps for Avoiding Surprise In-Use Product Failures
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity.
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As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might ...
- Blog
Dezember 07, 2017
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
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Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the ...
- Blog
August 22, 2017
Translating New Product Requirements into Hardware Architecture
Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – including multiple design tools – circuit design, PCB layout, mechanical design, spreadsheets, etc. that are used to track different elements of the design.
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Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – incl...
- Blog
August 02, 2017
Hardware Architecture Design Becomes the Next Competitive Requirement
After a lengthy quiet period, the hardware design process is suddenly experiencing numerous changes in the form of design discipline convergence and process extension. The widely used 2D single board PCB detailed design process is being replaced by a 3D multi-board and multi-discipline one.
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Hardware architecture design is becoming a competitive requirement as product complexity is on the rise and the room for error is shrinking.
- Blog
Juni 21, 2017
Predictive Failure Analysis Can Improve Product Quality: The Reality - Part 2 of 2
I recently talked on predictive failure analysis at the PTC LiveWorx 2017 conference. There was a lot of audience interest, so I thought I’d share some of the things I discussed. This is the second of two posts on this subject.
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We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality.
- Blog
März 17, 2016
Circuit Modular Reuse Best Practices
In my previous post in this series about effectively reusing design modules to increase product quality and decease development time, I challenged you to think about how well you’re making use of existing design modules and why getting better at this could be a competitive differentiator.
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In my previous post in this series about effectively reusing design modules to increase product quality and decease development time, I challenged...
- Blog
März 11, 2016
Are you Making the Most of Modular Design With Design Reuse? Part 1
In this two part series of blog posts, I’m going to be looking at reuse with modular design in PCB development, and how you can streamline your methodology to reduce design time, reduce design errors and increase product quality.
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Although we’ve been talking about it for years, in PCB design it has yet to catch on in quite the same way despite there being a host of benefit...