Elektrische und elektronische Entwicklungs- und Konstruktionsdaten stellen eine wertvolle Investition dar, die es gilt, so oft wie möglich zu nutzen und wiederzuverwenden. Um vorhandene Designdaten über den gesamten Produktlebenszyklus hinweg zu sichern, werden über den Lebenszyklus von hochwertigen Produkten immer wieder die Anforderung bestehen, die ursprünglichen Designdaten für ein moderneres und leistungsfähigeres ECAD-Tool aufzubereiten .Erfahren Sie mehr über den Unterschied zwischen Datenmigration und Datenkonvertierung und finden Sie heraus, welche Lösung für Ihr Unternehmen die richtige ist.
In today’s global value chains, data exchange and re-reuse are vital to support collaboration and productivity. But most data formats are proprietary. For any organization with an extensive database of ECAD data, the need for data migration will eventually arise.
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity.
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – including multiple design tools – circuit design, PCB layout, mechanical design, spreadsheets, etc. that are used to track different elements of the design.
After a lengthy quiet period, the hardware design process is suddenly experiencing numerous changes in the form of design discipline convergence and process extension. The widely used 2D single board PCB detailed design process is being replaced by a 3D multi-board and multi-discipline one.
I recently talked on predictive failure analysis at the PTC LiveWorx 2017 conference. There was a lot of audience interest, so I thought I’d share some of the things I discussed. This is the second of two posts on this subject.
In my previous post in this series about effectively reusing design modules to increase product quality and decease development time, I challenged you to think about how well you’re making use of existing design modules and why getting better at this could be a competitive differentiator.
In this two part series of blog posts, I’m going to be looking at reuse with modular design in PCB development, and how you can streamline your methodology to reduce design time, reduce design errors and increase product quality.