Signal Integrity Analysis

Fast, Interactive Time-Domain Simulation

Time-domain simulation provides rapid, interactive feedback on timing behavior, reflections, and crosstalk. Simulation results update quickly as design conditions change, giving clear visibility into waveform quality and delay characteristics. This responsiveness supports early identification of signal-integrity concerns and helps evaluate corrective options without disrupting the design flow.

Comprehensive Model Management for Signal-Integrity Simulation

The simulation environment supports a broad range of model types, enabling consistent access to the behavioral data required for accurate signal-integrity analysis. IBIS, SPICE, and S-parameter models can be organized and maintained within a unified library structure, ensuring that device behavior, interconnect characteristics, and frequency-dependent effects are represented with the necessary fidelity throughout the design process.

SPICE and S-Parameter Models in the Time Domain

SPICE and S-parameter models can be used directly in the time domain, offering flexibility in how active devices and passive interconnects are represented. SPICE captures nonlinear behavior, while S-parameters describe frequency-dependent effects, allowing the simulation approach to match circuit characteristics across a wide range of scenarios.

IBIS Buffer Models

IBIS buffer models provide a standardized way to represent I/O behavior, allowing simulations to align with industry expectations and integrate smoothly into established workflows. Their use ensures consistent switching, clamping, and timing characteristics across different devices. When Power-Aware IBIS models are included, additional effects such as simultaneous switching noise (SSN) are captured, giving a more complete view of how drivers and receivers behave under real operating conditions.

Interconnect Topology Optimization Using Parameter Sweeps

Parameter sweeps make it possible to observe how changes in geometry, spacing, or material settings influence interconnect behavior. This approach reveals the operating window for a given topology and highlights the conditions under which performance margins tighten or improve. The resulting insight supports topology choices that remain robust across expected manufacturing and environmental variations.

AI/ML-Based S-Parameter Modeling

Time-domain simulation depends on S-parameter data expressed in the frequency domain. AI and machine-learning methods support the vector-fitting process by identifying stable parameter sets that accurately represent the modeled structure.

Automatic Timing, Skew, and Signal-Integrity Results

Automatic timing, skew, and signal-integrity measurements provide a clear view of waveform quality, edge behavior, and alignment between related signals under operating conditions.

Influence of Manufacturing Tolerances and Material Properties

Variations in dielectric properties, copper thickness, and etching tolerances can affect impedance and propagation delay. Awareness of these effects supports more reliable stack-up and routing decisions, especially in high-speed designs where small deviations can influence performance margins.

Time-Domain Reflectometry for Interconnect Optimization

Time-domain reflectometry (TDR) provides a direct view of impedance variations along an interconnect. The resulting waveform highlights discontinuities from geometry, material, or via changes. These insights show where reflections may occur and how routing or stack-up adjustments influence signal behavior, supporting more reliable interconnect design.

TDR Impedance Assessment for Single-Ended and Differential Interconnects

TDR results provide visibility into impedance profiles for single-ended and differential interconnects. The measurements show where mismatches arise from geometry changes, material variations, or coupling effects. Because no IBIS buffer models are required, the method supports model-less signal-integrity evaluation and enables early verification of interconnect quality.

AMI Simulation for Gigabit SERDES Channel Optimization

AMI-based simulation models gigabit SerDes channels under realistic conditions, capturing equalization behavior, jitter tolerance, and channel loss. The results show how transmitter and receiver settings affect eye opening and bit-error performance, supporting decisions that strengthen high-speed link robustness.

Bit Error Ratio (BER) Evaluation

BER evaluation quantifies the likelihood of bit errors in a high-speed channel, providing a direct measure of communication reliability under expected operating conditions.

Serial Link Characterization

Serial links can be characterized through S-parameters, transfer functions, and impulse responses, providing a concise view of frequency- and time-domain channel behavior.

Jitter Consideration in TX and RX

Deterministic and random jitter in both transmit and receive paths are accounted for, clarifying jitter tolerance and its impact on signal integrity.

Eye Pattern and Bathtub Curve Visualization

Eye patterns and bathtub curves present signal quality and reliability metrics in a clear, interpretable form.

AMI Model Parameterization

AMI model parameters can be adjusted through a simplified interface, supporting efficient setup and consistent simulation control.

Eye Opening Measurement

Eye openings and signal-to-noise ratio (SNR) are measured to quantify signal quality and assess available performance margin.