Thank you for registering
Menu
Additional CR-8000 resources
- Presse-Information
Juli 07, 2026
Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance
Zuken Inc. today announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP). TSMC collaborates with its OIP EDA Alliance partners to address growing design demands, accelerate adoption of latest process and packaging technologies, and enable customers to achieve their PPA and time-to market targets.
Read now
- Presse-Information
Mai 28, 2026
Valeo und Zuken arbeiten zusammen, um das Design von Automobilelektronik neu zu definieren
Valeo and Zuken are partnering through the Zuken Valeo InnoLab to create an open, AI-assisted electronic design platform for automotive engineering. The collaboration combines Zuken’s AI architecture with Valeo’s AI Agents and industrial expertise to reduce design times, strengthen digital continuity, and support robust electronic design across the full design flow.
Read now
- Presse-Information
September 04, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.
Read now
- Presse-Information
Mai 08, 2025
Zuken stellt CR-8000 2025 mit KI-Unterstützung für High-Speed- und High-Density-PCB-Design vor
Erleben Sie CR-8000 2025: Intelligente Schaltplanautomatisierung, Echtzeit-Zuverlässigkeitsanalyse und KI-gestütztes Layout für High-Speed- und High-Density-PCBs.
Read now
- Presse-Information
März 24, 2025
Zuken tritt dem IBM Research AI Hardware Center bei, um AI-Hardware-Lösungen der nächsten Generation zu entwickeln
Zuken ist dem IBM Research AI Hardware Center beigetreten, um 3DIC-Packaging, KI-Hardware-Entwicklung und EDA-Workflows voranzutreiben. Die Zusammenarbeit konzentriert sich auf die Integration heterogener Chips, die Bewertung von Deep-Learning-Prozessen, die Materialentwicklung und Zuverlässigkeitstests. Die Partnerschaft unterstreicht das Engagement von Zuken, Innovationen im Bereich des KI-gesteuerten Chipdesigns und der nächsten Generation von Halbleiter-Packaging-Lösungen voranzutreiben.
Read now
- Webinare
Oktober 16, 2024
Advanced Electronics Collaboration: Zuken DS-CR and Dassault Systèmes’ 3DEXPERIENCE Platform
Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform
Watch Now