- Blog
Oktober 15, 2019
Tech Tip: Creating Panel Models and Inserting STEP Files
This video will show step by step instructions on how to create a basic Panel Model and insert a 3D STEP file.
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- Blog
Februar 26, 2019
Tech Tip: Routing a PCB design in a native 3D Tool
PCB design tools were built on 2D software methods in the 1980s. Many of today’s design tools still use that 2D code base. Mechanical tools have moved on to native 3D design. PCB has been stuck more or less in the 2D world. Extensions to the 2D code base made 2.5D and 3D visualization possible. But designing in 3D requires the tool to be built on a 3D kernel.
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- Blog
August 21, 2018
Connect CR-8000 with Polar Instruments' Speedstack PCB Stackup/ECAD Interface
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
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We're happy to announce that Speedstack, Polar Instruments' layer stackup design/documentation tools, can now be directly linked to Zuken's CR-800...
- Blog
April 10, 2018
Tech Tip: Creating New Terminals for Your Connectors in E3.series
This video illustrates the process of creating a new terminal to be used with your connectors in Zuken’s E3.series. It covers the attribute information that can be applied to this model, and the model needed for the correct terminal for any given wire size.
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This tech tip illustrates the process of creating a new terminal to be used with your connectors in Zuken's E3.series. It covers the attribute inf...
- Blog
Januar 12, 2017
The High-Speed Design Challenge of Maintaining PCB Signal Integrity in a 3D Design Environment
Ultra-high signal speeds demand detailed consideration of the third dimension in PCB design, including via structures and layer stacks. Today I’m going to focus on the challenge. In my two subsequent posts I’ll be reviewing what PCB designers can do to meet that challenge.
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Ultra-high signal speeds demand detailed consideration of the third dimension in PCB design, including via structures and layer stacks. Today I’...