Signal Integrity
- Blog
November 28, 2022
Boosting Power-Integrity-Analysis Performance by Introducing a Multi-Threading-Simulation Architecture
Zuken is taking its Simulation and Analysis Performance to the next level by introducing a new processing technology to its PI/EMI analysis tool. Multi-threading will speed up PI analysis which will give PCB designers a boost in productivity, especially when evaluating different design alternatives for PDN structures.
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- Blog
April 08, 2021
EMV-gerechtes Leiterplattendesign: Alles andere als schwarze Magie
EMV Probleme sind in der Leiterplatten-Konstruktionspraxis oft dafür verantwortlich, dass Re-Design-Zyklen notwendig werden. Aufgrund von immer kürzer Innovationszyklen von z.B. Mobiltelefonen oder IoT Applikationen wie Fitness-Trackern und vielen weiteren Elektronikprodukten sind diese zeitintensiven Re-Design-Zyklen unbedingt zu vermeiden.
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- Blog
September 10, 2020
Leistungsstarke SI/PI/EMV PCB-Simulationssoftware verkürzt die Analysezeit um 86%
Was tun, wenn Ihr nächstes Projekt besonders hohe EMV-Anforderungen stellt und schneller als jemals zuvor abgeschlossen werden muss?
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- Blog
Juni 30, 2020
CR-8000 2020 Supports Electronic Subsystem Design
CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool. CR-8000 2020 has all the bells and whistles for electronic subsystem development.
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- Blog
Februar 28, 2019
Inside Signal Integrity: Impedance Control - Part 2
In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.
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- Blog
Februar 21, 2019
Inside Signal Integrity: Impedance Control - Part 1
Impedance and impedance control belong to the oldest and most often discussed topics in PCB design. They are especially important with the high-speed design when related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.
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- Blog
August 21, 2018
Connect CR-8000 with Polar Instruments' Speedstack PCB Stackup/ECAD Interface
We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
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We're happy to announce that Speedstack, Polar Instruments' layer stackup design/documentation tools, can now be directly linked to Zuken's CR-800...
- Blog
August 14, 2018
Tech Tip: Assigning Device Models in CR-8000 Design Force Constraint Browser
CR-8000 Design Force can help you verify your design before you send it out to manufacture. Before running any signal integrity analysis in Design Force, you must assign device models to the pins in your components using the Constraint Browser.
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Design Force can help you verify your design before you send it out to manufacture. Before running any signal integrity analysis in Design Force, ...
- Blog
März 22, 2018
Mastering Power Integrity: First Get Your Power Distribution System Right
I don’t think I’m generalizing when I say that designers working on complex high speed designs really don’t want to expend a lot of time and effort dealing with power integrity problems. And they especially don’t want to do it using tools that are detached from their design flow. In today’s complex PCBs, we’re talking advanced processors, complex FPGAs and superfast memories, which all share various voltage ranges.
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I don’t think I’m generalizing when I say that designers working on complex high speed designs really don’t want to expend a lot of time and...
- Blog
Januar 27, 2017
Return Vias, Build-Up Layers and the Latest FPGAs to Battle Latest Signal Integrity Challenges
In the final installment of this blog series, you can learn how to use build-up layers and premium FPGAs to deal with the signal integrity challenges arising from high-speed signals in a 3D design capture world.
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Luckily, where signals need return vias, component vendors often do most of the work for you. Let’s look at a PCI Express differential pair. Fi...
- Blog
Januar 19, 2017
Using Vias to Maintain PCB Signal Integrity Featuring High-Speeds in a 3D Environment
This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and growing adoption of PCB design environments to design in true 3-D. Today I focus on vias and the use of return vias to overcome the issues highlighted in Part 1.
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This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and g...
- Blog
Januar 12, 2017
The High-Speed Design Challenge of Maintaining PCB Signal Integrity in a 3D Design Environment
Ultra-high signal speeds demand detailed consideration of the third dimension in PCB design, including via structures and layer stacks. Today I’m going to focus on the challenge. In my two subsequent posts I’ll be reviewing what PCB designers can do to meet that challenge.
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Ultra-high signal speeds demand detailed consideration of the third dimension in PCB design, including via structures and layer stacks. Today I’...
- Blog
November 01, 2010
S-Parameters: Microwave goes Mainstream for High-Speed PCB Design Part 1
I’d like to explain to you in straightforward terms what S-Parameters are and why they’re so useful. When I say “straightforward”, I mean that in a technical sense, but this is a specialised area. If you’re not designing high-speed PCBs, or you don’t know much about signal integrity, you might want to tune out now.
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So here goes. Mainstream high-speed PCB design has generally followed in the slipstream of RF and microwave engineering. This is often out of nece...