Search Results for: PCB

360 results found
PCEA (Printed Circuit Engineering Association)
MAR 6, 2024
Artificial Intelligence in Electronics (Industry Panel Discussion Hosted by PCEA)
Worldwide
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sustainable product development
  • Blog
November 14, 2024
Zuken Manufacturing Innovation and Digital Transformation

Explore Zuken’s commitment to transforming manufacturing through digital innovation, AI-driven solutions, and sustainability for future-ready industries.

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  • Webinar
October 07, 2024
Advanced Electronics Collaboration: Zuken DS-CR and Dassault Systèmes’ 3DEXPERIENCE Platform

Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.

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  • Press Release
March 24, 2025
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.

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  • Products
May 08, 2025
What's New in CR-8000 Release 2025

CR-8000 Release 2025 brings enhanced simulation workflows, strengthened multi-board 3D co-design, expanded AI-assisted routing, and tighter PLM synchronization

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DSEI - Create Tomorrow’s Connected Defense Systems
SEP 9, 2025
DSEI 2025 - UK
London / ExCeL London, United Kingdom (UK)

Create Tomorrow’s Connected Defense Systems - Visit Zuken at DSEI in Hall S15-330 - ExCeL Centre London, UK - Sept 09-12, 2025

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VISIT
SI-GUYS-donald-telian-training-510x290
OCT 29, 2025
Signal Integrity In Practice – Live Hands‑On SI Class
Munich / Munich Airport Business Centre (MUC), Germany

A two‑day workshop where hardware engineers and SI specialists master Gen2 signal integrity through classroom instruction, hands‑on labs and software‑driven exercises.

Third-Party Training
Third-Party Training
JOINT3_logo_TN-510x310
  • Press Release
September 04, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

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How Connected Products and Modular Design Can Improve Your Product Quality
  • Blog
October 04, 2018
How Connected Products and Modular Design Can Improve Your Product Quality

Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product performance and reliability and reduce development time.

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Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product pe...
Connect Your Component Library to the Supply Chain
  • Blog
October 05, 2018
Connect Your Component Library to the Supply Chain

Take a walk in the engineer’s shoes: I need an 80 MHZ network controller for my new project and I found one in the PLM/PDM system. That was easy. Now a quick check in the procurement database to do a price and availability check. So far so good, now on to the component engineering system to see if there are any possible lifecycle issues with a 10-year minimum requirement. It’s my lucky day, no issues and it’s a company-preferred part with an ECAD library instance.

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Design engineers must have the ability to make intelligent component selections involving critical supply chain information without having to leav...
IoT
  • Blog
October 25, 2018
Bridging the Gap between the Maker Movement and Mass Production Technology with IoT and the Trillion-Node Engine

Japan is one of the first countries to face the combination of challenges such as energy issues, population decline and an aging society. Solving these problems with the benefit of the Internet of Things (IoT) could generate future business opportunities as well as meeting the demands of society. Enabling as many people as possible to try out new ideas, and encouraging them to develop diverse products, will broaden these opportunities. The Trillion-Node Engine is a platform for realizing this objective.

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  • Blog
December 31, 2018
Mitigating Board Complexity with System-level Engineering

Well, there’s no doubt about it: Developing circuit boards is getting more complex. Demand for faster data speeds is increasing. Boards are becoming more dense. Requirements call for the latest protocols and devices. Packaging constraints call for multi-board and flex-board systems. The surest sign of escalating board complexity lies in the fact that few are designed by a single engineer. Today, most require the coordination of many engineers instead. And overall, this trend shows no sign of abating. Board complexity looks like it will only get worse...

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There’s no doubt that board systems are getting more complex. System-level engineering can help mitigate those risks. One of the main advantages is ...
Additive Manufacturing Helps Build Lower Cost Replacement Parts and Tools
  • Blog
November 29, 2018
Additive Manufacturing Helps Build Lower Cost Replacement Parts and Tools

It has often been noted that many of the aircraft and other weapons systems used by the armed forces are older than the service men and women operating and maintaining them. While the average age of a U.S. domestic commercial airliner is 11 years, it is not uncommon for aircraft to still be in service at 30 years. Likewise, there are many machines and systems in electric power generation, discrete parts manufacturing, chemical process, oil and gas production and many other industries that have been in continuous operation for several decades or longer.

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Additive manufacturing technology helps save significant time and cost in the maintenance and repair of machinery and systems across industries. ...
Modular Board Design
  • Blog
December 06, 2018
Modular Board Design: A Platform Approach to Increase Product Variants and Decrease Components

It sounds like a paradox: electronics manufacturers can increase variation within a product line while using fewer electronic components. Reuse keeps product costs low, increases product flexibility and customization. Far from paradoxical, the approach is quite doable today through a process called modular board design coupled with predictive analysis numbers returned by the Internet of Things.

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Modular board design coupled with predictive analysis results gathered from the Internet of Things keeps product costs low and increases flexibili...
Tech Tip: Using Inhibit Layers to Clear Trace Patterns
  • Blog
December 18, 2018
Tech Tip: Using Inhibit Layers to Clear Trace Patterns

In this tech tip, we will explore how you can clear a routed trace pattern on multiple conductive layers. Watch our video to go through the steps with us.

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digital elements overlaying the real-world environment, signifying innovative advancements in public transportation technology.
  • Blog
February 07, 2019
3D Printing for Electronic and Electrical Systems

If you’ve tracked some of the hot topics in engineering over the last year, you’re likely very aware of 3D printing or additive manufacturing. This method lays down successive layers of plastic or metallic material that then fuses them together. Over time, those successive layers add up to make fully formed components...

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