Search Results for: PCB
- Blog
Explore Zuken’s commitment to transforming manufacturing through digital innovation, AI-driven solutions, and sustainability for future-ready industries.
- Webinar
Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.
- Press Release
Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.
- Products
CR-8000 Release 2025 brings enhanced simulation workflows, strengthened multi-board 3D co-design, expanded AI-assisted routing, and tighter PLM synchronization
Create Tomorrow’s Connected Defense Systems - Visit Zuken at DSEI in Hall S15-330 - ExCeL Centre London, UK - Sept 09-12, 2025
A two‑day workshop where hardware engineers and SI specialists master Gen2 signal integrity through classroom instruction, hands‑on labs and software‑driven exercises.
- Press Release
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.
- Blog
Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product performance and reliability and reduce development time.
- Blog
Take a walk in the engineer’s shoes: I need an 80 MHZ network controller for my new project and I found one in the PLM/PDM system. That was easy. Now a quick check in the procurement database to do a price and availability check. So far so good, now on to the component engineering system to see if there are any possible lifecycle issues with a 10-year minimum requirement. It’s my lucky day, no issues and it’s a company-preferred part with an ECAD library instance.
- Blog
Japan is one of the first countries to face the combination of challenges such as energy issues, population decline and an aging society. Solving these problems with the benefit of the Internet of Things (IoT) could generate future business opportunities as well as meeting the demands of society. Enabling as many people as possible to try out new ideas, and encouraging them to develop diverse products, will broaden these opportunities. The Trillion-Node Engine is a platform for realizing this objective.
- Blog
Well, there’s no doubt about it: Developing circuit boards is getting more complex. Demand for faster data speeds is increasing. Boards are becoming more dense. Requirements call for the latest protocols and devices. Packaging constraints call for multi-board and flex-board systems. The surest sign of escalating board complexity lies in the fact that few are designed by a single engineer. Today, most require the coordination of many engineers instead. And overall, this trend shows no sign of abating. Board complexity looks like it will only get worse...
- Blog
It has often been noted that many of the aircraft and other weapons systems used by the armed forces are older than the service men and women operating and maintaining them. While the average age of a U.S. domestic commercial airliner is 11 years, it is not uncommon for aircraft to still be in service at 30 years. Likewise, there are many machines and systems in electric power generation, discrete parts manufacturing, chemical process, oil and gas production and many other industries that have been in continuous operation for several decades or longer.
- Blog
It sounds like a paradox: electronics manufacturers can increase variation within a product line while using fewer electronic components. Reuse keeps product costs low, increases product flexibility and customization. Far from paradoxical, the approach is quite doable today through a process called modular board design coupled with predictive analysis numbers returned by the Internet of Things.
- Blog
In this tech tip, we will explore how you can clear a routed trace pattern on multiple conductive layers. Watch our video to go through the steps with us.
- Blog
If you’ve tracked some of the hot topics in engineering over the last year, you’re likely very aware of 3D printing or additive manufacturing. This method lays down successive layers of plastic or metallic material that then fuses them together. Over time, those successive layers add up to make fully formed components...