Neueste Zuken-Blog-Posts
Willkommen im neuen Zuhause für den Zuken-Blog. Bleiben Sie auf dem Laufenden mit den neuesten Nachrichten, Blogs, Entwicklungen von Zuken und Branchenexperten.
Menu
Abonnieren Sie den Zuken-Blog und erhalten Sie die neuesten Informationen gleich nach ihrer Veröffentlichung direkt in Ihrem Posteingang. Behandelte Themen: PCB Design, Electrical / Fluid Design, Digital Enterprise and People & Markets
Sie können sich von der zentralen Abmeldeseite jederzeit von jedem Blog-Feed oder von Marketing-E-Mails von Zuken abmelden.
Alle Beiträge in chronologischer Reihenfolge
- Blog
Januar 25, 2018
Advanced Packaging with Zuken’s CR-8000 Design Force
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs.
Read now
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for ove...
- Blog
Januar 23, 2018
Tech Tip: Generating Where-used Reports in DS-CR (formerly known as DS-2)
One of the more powerful capabilities of a good data management system such as DS-CR (formerly known as DS-2) is searching and the ability to generate reports. A great example is the ability to generate Where-used information. These types of reports are extremely useful when performing impact assessments where ...
Read now
One of the more powerful capabilities of a good Data Management system such as DS-2 is searching and the ability to generate reports. A great exam...
- Blog
Januar 18, 2018
Four Steps for Avoiding Surprise In-Use Product Failures
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity.
Read now
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might ...
- Blog
Januar 16, 2018
Tech Tip: How to Create Custom Workspaces in E3.series
The customization and workspace flexibility is one more way for E3.series to give the user what they need and want. All workspace customizations can be saved locally to provide a consistent user interface.
Read now
The customization and workspace flexibility is one more way for E3.series to give the user what they need and want. All workspace customizations c...
- Blog
Januar 09, 2018
Tech Tip: Accelerated Electrical Designs with Excel and E3.series
We are all looking to gain productivity in our design cycle to save time and reduce costs. A good method to get a head start is to use Excel or a .csv file to get the design started and load devices into you project. The most common application is to load the connectors and signals from Printed Circuit Board (PCB) in the electrical design. Blocks can be used to represent systems and the Excel sheet can help you get the system information from other teams or 3rd party vendors.
Read now
We are all looking to gain productivity in our design cycle to save time and reduce costs. A good method to get a head start is to use Excel or a ...
- Blog
Januar 09, 2018
Self-Driving Bus is 3D Printed in Only a Few Weeks
The automobile business spends a year or two designing a new vehicle, then another year or two building tools to produce it in high volumes. Local Motors has turned that paradigm on its head with its Olli, the self-driving, electric shuttle.
Read now
Traditionally, the automobile business spends a year or two designing a new vehicle, then another year or two building tools to produce it in high...
- Blog
Dezember 07, 2017
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
Read now
Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the ...
- Blog
November 28, 2017
Tech Tip: How to Set-up Shared Sheets or Drawings in E3.series
E3.series with the shared sheet option for panels and formboard/nailboard makes it easy to design a large system and we will be looking at the quick steps needed to get started.
Read now
E3.series with the shared sheet option for panels and formboard/nailboard makes it easy to design a large system and we will be looking at the qui...
- Blog
November 20, 2017
Tech Tip: How to Set-up Autorouting in E3.series
E3.series 2017 brings improved automatic routing for making connections by adding automatic connections between selected items. The most common controls are based on the following scenarios ...
Read now
E3.series 2017 brings improved automatic routing for making connections by adding automatic connections between selected items.
- Blog
November 16, 2017
What High Tech Industries Can Learn about Managing Data from the Early Days of CAD
Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manually. We would then work out the connection lengths of wire harnesses by laying out waxed cord lacing on a physical prototype.
Read now
Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manual...
- Blog
November 13, 2017
Toshiba – RF Module Shrink (TransferJet™)
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm...
Read now
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phon...
- Blog
November 09, 2017
Pantec Automation Cuts Manufacturing Time by Almost Half Using E3.series
The only thing I like more than a good win-win situation is when there’s a win-win-win. That was the conclusion I drew when I discovered how Pantec Automation, which designs and manufactures control systems for machines, used E3.series to almost halve its manufacturing times.
Read now
The only thing I like more than a good win-win situation is when there’s a win-win-win. That was the conclusion I drew when I discovered how Pan...
- Blog
Oktober 26, 2017
Ethernet Emerges as Communications Platform for Next Generation of Vehicles
Each new generation of automobiles has an increasing number of electronic systems that require communications with other vehicle systems at ever higher speeds. The proliferation of advanced driver assistance systems (ADAS) with fully autonomous vehicles on the horizon has greatly increased the amount of bandwidth that must be transferred between the many processors, cameras, radar units, display head units, etc. on current and next-generation vehicles...
Read now
As vehicles transition to higher levels of autonomous driving, networking requirements are growing at a rapid rate. The top contender to meet thes...
- Blog
Oktober 24, 2017
Autonomous Vehicles – Just How Long?
Many of the major players in the automotive industry are going full throttle towards autonomous vehicles. But when are we likely to see these vehicles upscale and become a mass consumer item? It’s a hotly debated question.
Read now
Many of the major players in the automotive industry are going full throttle towards autonomous vehicles. But when are we likely to see these vehi...
- Blog
Oktober 11, 2017
The Challenges of 3D PCB Designing (PCB West Interview)
During PCB West Exhibition Day, Sierra Circuits met Humair Mandavia, Chief Strategy Officer at Zuken. After his joint interview with Simon Fried, CBO of Nano Dimension, we discussed 3D PCB designing, and Zuken’s product, CR-8000 with him.
Read now
During PCB West Exhibition Day, Sierra met Humair Mandavia, Chief Strategy Officer at Zuken. After his joint interview with Simon Fried, CBO of Na...
- Blog
Oktober 09, 2017
How to Improve Flexible Printed Circuit Manufacturing (PCB West Interview)
Sierra met Steve Watt, Manager of PCB Engineering at Zuken, during PCB West 2017 at the Santa Clara Convention Center. After his presentation on how to improve flexible printed circuit manufacturing, he shared a few tips in front of our camera. Listen to him discuss CR-8000, DfM checks, and flexible PCB designing.
Read now
Sierra Circuits met Steve Watt, Manager of PCB Engineering at Zuken, during PCB West 2017 at the Santa Clara Convention Center. After his presenta...