Search Results for: PCB

355 results found
zuken-staff-profile-featured-img-v2-1-510x310
  • Blog
October 11, 2018
Meet Our People: Tom, Chief Software Engineer in Bristol, UK

Tom Lucas joined Zuken in 1997 and has been challenged in a variety of roles and rewarded with promotion opportunity. Today he is part of a small but mighty team of three specializing in PCB routing research, and is based in the Zuken Technology Centre in Bristol, UK.

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Translating New Product Requirements into Hardware Architecture
  • Blog
August 22, 2017
Translating New Product Requirements into Hardware Architecture

Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – including multiple design tools – circuit design, PCB layout, mechanical design, spreadsheets, etc. that are used to track different elements of the design.

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Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – incl...
What High Tech Industries Can Learn about Managing Data from the Early Days of CAD
  • Blog
November 16, 2017
What High Tech Industries Can Learn about Managing Data from the Early Days of CAD

Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manually. We would then work out the connection lengths of wire harnesses by laying out waxed cord lacing on a physical prototype.

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Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manual...
Fan-out Wafer-level Packaging and CR-8000
  • Blog
December 07, 2017
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product

Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.

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Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the ...
Why Renishaw choose Zuken, Plus Awesome Movie Bloopers
  • Blog
February 05, 2019
Making Movies with Customers: Why Renishaw choose Zuken, Plus Awesome Movie Bloopers

It’s not often you spend your work day laughing AND learning. But that’s how it went for Zuken Europe’s first foray into filming videos with our customers.

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how to design a printed circuit board
  • Press Release
July 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Chip-Package-Board Co-Design, DFM Center
  • Datasheet
March 06, 2017
CR-8000 Graphical Pin Manager
Datasheet
A small figurine resembling an electrician next to a green printed circuit board (PCB), troubleshooting and management of electronic components for 3D collision and clearance checks in PCB design
  • Blog
April 15, 2021
Tech Tip: 3D Collision and Clearance Checks in Multi-Board Design

Checking for potential electromechanical collisions is usually done more in the mechanical design environment. However, shifting the check to the electrical side during component placement can help create a more robust product. For multi-board PCB design, there are several built-in checks in Design Force that validate the design for collision and clearance requirements.

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ECAD Data migration or data conversion
  • Blog
May 16, 2022
ECAD Data Migration vs. Data Conversion

Electrical and electronic design data represent a valuable investment, which should be used and reused as much as possible. In order to preserve the investment into existing design data throughout the product lifecycle, there will always be a requirement to process the original design data using a more modern and powerful ECAD tool. Learn more about the difference between data migration and data conversion, and find out what the right fit for your organization is.

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Power Integrity Analysis Performance
  • Blog
November 28, 2022
Boosting Power Integrity Analysis Performance by Introducing a Multi-Threading-Simulation Architecture

Zuken is taking its Simulation and Analysis Performance to the next level by introducing a new processing technology to its PI/EMI analysis tool. Multi-threading will speed up PI analysis which will give PCB designers a boost in productivity, especially when evaluating different design alternatives for PDN structures.

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PCB Design Data Management - DS-CR
  • Products
October 01, 2018
DS-CR

DS-CR supports the specific demands of PCB design data management. It combines multi-site library, design data, and configuration management capabilities into a unified engineering environment.

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PCB Design Data Management
Digital-harness-augmented-reality-virutual-reality-510x310
  • Solutions
October 15, 2018
AI/AR and Machine Learning
New opportunities for early adopters
ddr5 pcb design
  • Webinar
November 15, 2019
How to be First to Market with DDR5!

DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.

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The risk of crosstalk, ‘crosstalk’ stems from the days of telephone exchanges
  • Blog
March 28, 2019
“You’re connected now caller” The risks of crosstalk

Did you know the expression ‘crosstalk’ stems from the days of telephone exchanges, as staffed by operators connecting parties who could sometimes and unintentionally hear someone else’s conversation? The talk was, literally, crossing over from one line to another.

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Night view of the Petronas Twin Towers in Kuala Lumpur, the concept of building a digital twin through MCAD and ECAD collaboration.
  • Blog
March 07, 2019
Building the Digital Twin with MCAD-ECAD Collaboration

In this post, we’ll give an overview of what Zuken is doing to address the design domain convergence. We’ve been working hard to improve both the CR-8000 and E3.series solutions to make collaboration between electrical and mechanical engineers easier than ever.

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digital twin technology, network and data graphics, illustrating the fusion of real and virtual worlds for advanced simulations and analyses - understand digital twin technology with E3.series
  • Pages
June 12, 2018
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