Suchergebnisse für: PCB
335 Suchergebnisse
- Blog
September 15, 2017
Does the Release Process to Manufacturing Keep You Up at Night?
Have you ever finished generating the manufacturing release package for the latest product design and then it occurred to you that something may be wrong? Imagine, it’s Thursday night and you just finished a nice dinner with the family. Your daughter’s soccer team won and the Broncos are playing the Chiefs tonight. It will be great to relax and enjoy the game.
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Have you ever finished generating the manufacturing release package for the latest product design and then it occurred to you that something may b...
- Blog
Januar 25, 2018
Advanced Packaging with Zuken’s CR-8000 Design Force
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs.
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Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for ove...
- Blog
Februar 05, 2019
Making Movies with Customers: Why Renishaw choose Zuken, Plus Awesome Movie Bloopers
It’s not often you spend your work day laughing AND learning. But that’s how it went for Zuken Europe’s first foray into filming videos with our customers.
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- Blog
Februar 13, 2023
Ein Interview mit ChatGPT
Künstliche Intelligenz ist in aller Munde, seit die Medien über den KI-basierten Textgenerator ChatGPT berichtet haben. Wir haben uns mit ChatGPT ein Interview geführt.
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- Products
Oktober 01, 2018
System Planner
System Planner ist das erste Werkzeug, das ein vollständiges Architekturkonzept von Elektronikprodukten unterstützt. Bislang getrennte Schritte werden intelligent in einer einzigen Applikation zusammengeführt.
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Architekturkonzeption und Validierung
- Products
Oktober 04, 2018
CADSTAR Schematic
- Presse-Information
Dezember 13, 2017
SamacSys parts libraries for CR-8000
Presse-Information, Component Editor
- Products
September 27, 2023
KI-gestützte Leiterplattenentwicklung
CR-8000
Zuken kündigt den Einsatz von KI im PCB Design an: Autonomous Intelligent Place and Route (AIPR) ist eine Erweiterung der CR-8000 Produktreihe.
- Blog
Oktober 11, 2018
Meet Our People: Tom, Chief Software Engineer in Bristol, UK
Tom Lucas joined Zuken in 1997 and has been challenged in a variety of roles and rewarded with promotion opportunity. Today he is part of a small but mighty team of three specializing in PCB routing research, and is based in the Zuken Technology Centre in Bristol, UK.
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- Blog
August 22, 2017
Translating New Product Requirements into Hardware Architecture
Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – including multiple design tools – circuit design, PCB layout, mechanical design, spreadsheets, etc. that are used to track different elements of the design.
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Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – incl...
- Blog
November 16, 2017
What High Tech Industries Can Learn about Managing Data from the Early Days of CAD
Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manually. We would then work out the connection lengths of wire harnesses by laying out waxed cord lacing on a physical prototype.
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Because I’ve been in the electrical/electronics (E/E) engineering industry for such a long time, I can still remember drawing PCB layouts manual...
- Blog
Dezember 07, 2017
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
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Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the ...
- Blog
September 12, 2018
Metal Additive Helps Overcome Tough Electronics Cooling Challenge
Man-carried military communication systems often consume large amounts of power. The heat must be removed from the electronics package to avoid frying sensitive electronic components. The package typically is designed to be carried in a backpack which often puts difficult constraints on the form factor and weight of the system
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Man-carried military communication systems often consume large amounts of power. The heat must be removed from the electronics package to avoid fr...
- Presse-Information
Januar 25, 2017
SamacSys Bibliothek für CADSTAR
Presse-Information
- Blog
November 04, 2024
Effektive Strategien für das Management veralteter Bauteile
Die Aktualisierung bestehender Designs, um veraltete Komponenten zu ersetzen, ist eine zeit- und arbeitsintensive Aufgabe. Moderne PCB-Design-Tools wie CR-8000 können dabei helfen, diesen Prozess zu optimieren.
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- Blog
November 28, 2022
Boosting Power-Integrity-Analysis Performance by Introducing a Multi-Threading-Simulation Architecture
Zuken is taking its Simulation and Analysis Performance to the next level by introducing a new processing technology to its PI/EMI analysis tool. Multi-threading will speed up PI analysis which will give PCB designers a boost in productivity, especially when evaluating different design alternatives for PDN structures.
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