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Harness Builder for E3.series 2026 adds new integrations and export options that help wire harness teams move from design data to manufacturing outputs with fewer manual steps.

The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines - particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows.

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

Zuken is relocating the E3.series development team to a new, state-of-the-art facility in Neu-Ulm.

Visit Zuken at DSEI 2025, Stand S15-330, to see how our solutions are shaping the future of defence & security electronics development.