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Latest Resources

TSMC2026_04-510x310
  • Press Release
July 07, 2026
Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance

Zuken Inc. today announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP). TSMC collaborates with its OIP EDA Alliance partners to address growing design demands, accelerate adoption of latest process and packaging technologies, and enable customers to achieve their PPA and time-to market targets.

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Z0635-1-Zuken-Valeo-Team-510x310
  • Press Release
May 28, 2026
Valeo and Zuken join forces to redefine automotive electronic design

Valeo and Zuken are partnering through the Zuken Valeo InnoLab to create an open, AI-assisted electronic design platform for automotive engineering. The collaboration combines Zuken’s AI architecture with Valeo’s AI Agents and industrial expertise to reduce design times, strengthen digital continuity, and support robust electronic design across the full design flow.

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wp-header-1920x844-genesys-2026-2-2-510x310
  • Press Release
April 28, 2026
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows

Zuken has released GENESYS 2026, an updated model-based systems engineering platform that improves performance, expands access to model-based information, and enhances reporting and diagramming for engineering teams.

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Zuken Releases Harness Builder for E3.series 2026 for Wire Harness Manufacturing
  • Press Release
March 10, 2026
Zuken Releases Harness Builder for E3.series 2026 for Wire Harness Manufacturing

Harness Builder for E3.series 2026 adds new integrations and export options that help wire harness teams move from design data to manufacturing outputs with fewer manual steps.

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Electric Car, Electric Vehicle, Charging - Sports, Working, Showing
  • Webinar
October 16, 2025
What's New in E3.series 2026 for Wire Harness Design
Webinar, E3.cable, E3.3D RoutingBridge, E3.3DTransformer
Watch Now
e3-splash-screen-2026-20250805-510x310
  • Press Release
September 09, 2025
E3.series Release 2026

The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines - particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows.

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