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33 results found
2025-04-22-10_16_03-Greenshot-510x310
  • Press Release
May 08, 2025
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
Press Release
Z0603-IBM-Research-AI-Hardware-Center-1920x956-1-510x310
  • Press Release
March 24, 2025
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.

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Zuken's Smart Autorouter
  • Press Release
September 27, 2023
Zuken Introduces AI-Powered PCB Place and Route Technology for CR-8000

Zuken Inc. introduces a revolutionary approach to AI-assisted PCB design. The new technology, called Autonomous Intelligent Place and Route, will be provided as part of Zuken’s established CR-8000 PCB engineering and design platform

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Zuken DF Reuse Template
  • Press Release
August 30, 2023
Zuken Unveils CR-8000 2023 with Enhanced Design Efficiency and Analysis for High-Density, High-Speed PCB Designs

CR-8000 Release 2023 includes numerous innovations to enhance design efficiency and analysis to address the challenges of high-density and high-speed PCBs

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Next-Generation 3D LSI-Semiconductor Mounting Design Technology
  • Press Release
December 06, 2022
Zuken Supports Next-Generation 3D LSI-Semiconductor Mounting Design Technology

Zuken helps to overcome design challenges associated with 3D integration in the pursuit of next-generation semiconductor technologies.

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Z0573-pcb-ribbon-bond-wires-510x310
  • Press Release
December 05, 2022
Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules

Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.

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Man interacting with global map
  • Press Release
March 29, 2022
Yokogawa Electric Selects Zuken’s CR-8000 as New Electronic Design Environment

Yokogawa Electric selects CR-8000 to restructure their electronic design environment in Japan, China and Korea tackling product complexity and technology challenges.

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ERP-document-management-iStock-1920-1080-510x310
  • Press Release
December 14, 2021
SAP Certifies Zuken Interface for SAP S/4HANA

The integration enables data and metadata generated in Zuken’s systems to be used in company-wide business processes managed in SAP, such as concurrent engineering, module management, configuration management, component management as well as change and release management. 

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CR-8000 / DS-CR
  • Press Release
November 02, 2021
Panasonic and Zuken Complete Agreement for Electronic Design Solution

Panasonic Imaging Business Unit places 150 million JPY software contract for CR-8000 and DS-CR as solutions for electronic design and data management.

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CR-8000 R2021
  • Press Release
July 07, 2021
Zuken’s CR-8000 2021 Advances Early Design Analysis and Reuse Functionality

CR-8000 advances system-level PCB design with significant enhancements in analog simulation, SI analysis, and intelligent layout and routing

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how to design a printed circuit board
  • Press Release
June 16, 2020
CR-8000 2020

Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

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FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
PR-Z0512-CHIPS-1-510x310
  • Press Release
May 22, 2019
Zuken joins the UCLA CHIPS consortium
Press Release, Design Force Advanced Packaging
Board specification from CR-8000 Design Force is exported to Speedstack.
  • Press Release
August 21, 2018
Polar Speedstack PCB Stackup Interface
Press Release, Design Force, Design Force Advanced Packaging, DFM Center, Simulation and Analysis
how to design a printed circuit board
  • Press Release
July 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Chip-Package-Board Co-Design, DFM Center
Z0483-Zuken-XJTAG-partnership-510x310
  • Press Release
February 22, 2018
XJTAG DFT Assistant for CR-8000 Design Gateway
Press Release, CR-8000, System Architecture Design, Programmable Logic
Z0484-Samacsys2-CR-8000-3D-2-510x310
  • Press Release
December 13, 2017
SamacSys parts libraries for CR-8000
Press Release, Component Editor