Connect CR-8000 with Polar Instruments’ Speedstack PCB Stackup/ECAD Interface

Connect CR-8000 with Polar Instruments’ Speedstack PCB Stackup/ECAD Interface


polar instrumentsWe’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.

Design Force users can now exchange pre-layout designs seamlessly thanks to Polar’s Speedstack for IC packaging and PCB design. CR-8000 DFM Center can validate the stackup before it’s released to manufacturing.

The link also empowers designers to:

  • Simplify material communication during the supply chain
  • Preserve signal integrity design accuracy throughout product development
  • Avoid material and impedance duplication
  • Access high-speed materials online

The interface relays comprehensive material information required for complex designs with high layer counts. Zuken customers can also access Polar’s expansive online library of high-speed base materials. Impedance information within the Speedstack is loaded into CR-8000’s environment; no tedious and error-prone manual entry is required.

For more information, read Polar and Zuken’s official announcement.

Bob Potock
Bob Potock
Vice President of Marketing, Zuken USA, Inc.
Bob Potock is Vice President of Marketing for Zuken USA, Inc. and has held positions at companies that include Altium, Mentor Graphics, AT&T Bell Labs and Intel. Bob enjoys living in Colorado and a range of outside activities that include mountain biking, hiking, fly fishing and golf.