Connect CR-8000 with Polar Instruments’ Speedstack PCB Stackup/ECAD Interface
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We’re happy to announce that Speedstack, Polar Instruments’ layer stackup design/documentation tools, can now be directly linked to Zuken’s CR-8000 Design Force and DFM Center.
Design Force users can now exchange pre-layout designs seamlessly thanks to Polar’s Speedstack for IC packaging and PCB design. CR-8000 DFM Center can validate the stackup before it’s released to manufacturing.
The link also empowers designers to:
- Simplify material communication during the supply chain
- Preserve signal integrity design accuracy throughout product development
- Avoid material and impedance duplication
- Access high-speed materials online
The interface relays comprehensive material information required for complex designs with high layer counts. Zuken customers can also access Polar’s expansive online library of high-speed base materials. Impedance information within the Speedstack is loaded into CR-8000’s environment; no tedious and error-prone manual entry is required.
For more information, read Polar and Zuken’s official announcement.
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Vice President of Marketing, Zuken USA, Inc.
Bob Potock is Vice President of Marketing for Zuken USA, Inc. and has held positions at companies that include Altium, Mentor Graphics, AT&T Bell Labs and Intel. Bob enjoys living in Colorado and a range of outside activities that include mountain biking, hiking, fly fishing and golf.
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