a PCB design layout with various parameters and settings on the right-hand side, illustrating the process of preparing the design data for export and subsequent simulation. integration capabilities between ECAD and MCAD tools for advanced engineering simulations.

Tech Tip: How to export MCAD data from CR-8000 Design Force to enable faster thermal simulation in ANSYS Icepak

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This video demonstrates how you can export a STEP file from CR-8000 Design Force including automatically editing your package shape and deformation spec to reduce heat transfer and fluid flow simulation time in ANSYS Icepak. Changing the micro-bumps in the detailed model using an octagonal shape and simplifying the grid pattern (size) will reduce the meshing and calculation time without sacrificing accuracy, leading to faster thermal simulation.

Tunir Dey
Tunir Dey
Tunir Dey was serving as an Applications Engineer for CR-8000 products at Zuken Inc. Tunir worked closely with customers in system-level schematic design using Design Gateway, PCB layout design using Design Force, constraint management, topology development, SI, PI, and EMC analysis. Before joining Zuken, Tunir used to serve as a Product Engineer intern in one of the major EDA companies and was responsible for RF, Microwave, high frequency, and high-speed simulation. Tunir graduated from Purdue University with an MS in Electrical Engineering (RF and Microwave) and an MBA in Finance from Indiana University.
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