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Latest Blog Posts
- Blog
Executives’ Perspectives on Digital Transformation #6
- Blog
Modern electronic products are no longer built around a single PCB. As systems become faster, denser, and more interconnected, engineering teams are being forced to rethink how they design, verify, and manage complex multi-board products.
Latest Resources
- Press Release
Valeo and Zuken are partnering through the Zuken Valeo InnoLab to create an open, AI-assisted electronic design platform for automotive engineering. The collaboration combines Zuken’s AI architecture with Valeo’s AI Agents and industrial expertise to reduce design times, strengthen digital continuity, and support robust electronic design across the full design flow.
- Press Release
Zuken has released GENESYS 2026, an updated model-based systems engineering platform that improves performance, expands access to model-based information, and enhances reporting and diagramming for engineering teams.
- Press Release
Harness Builder for E3.series 2026 adds new integrations and export options that help wire harness teams move from design data to manufacturing outputs with fewer manual steps.
- Webinar
- Press Release
The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines - particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows.
- Press Release
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.