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Latest Blog Posts
- Blog
E3.series automation is entering a new era as Microsoft phases out VBS. With the official Python package, Zuken offers a modern, future-proof way to automate E3.series while preserving all familiar capabilities.
- Blog
Use Fields in E3.series to stop splitting designs across multiple pages, keep device inheritance correct, and generate clean reports when multiple functions share one sheet.
Latest Resources
- Webinar
- Press Release
The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines - particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows.
- Press Release
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.
- Press Release
Zuken is relocating the E3.series development team to a new, state-of-the-art facility in Neu-Ulm.
- Press Release
Visit Zuken at DSEI 2025, Stand S15-330, to see how our solutions are shaping the future of defence & security electronics development.
- Press Release
This latest release of GENESYS 2025 focuses on enhancing model structure, streamlining interoperability between tools, and accelerating the adoption of key industry standards that are vital for designing large-scale mission-critical and enterprise systems.