ZIW Europe Digital 2020

English Language Webinars
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English Presentations

View details of the English language sessions below.

In addition, view the full ZIW Digital Europe agenda, including all language sessions within the PDF.

PDF Agenda Digital – Download

E3.series

Process Chain to mCAD by E3.3DTransformer

Date: Wednesday 3rd June 2020 – 14:00 CET
Presenter:
Reinhold Blank

In many cases, the mechanical model determines the placement and routing of the electrical design and is created using systems such as Dassault Systemes CATIA/SolidWorks, Siemens NX, PTC Creo, Inventor, etc.

Zuken’s E3.3DTransformer is able to read the various MCAD 3D formats and extract the wiring harness-related artifacts. A complete 3D visualization as well as powerful verification and healing functions ensure the consistency of electrical and mechanical design and contribute to the realization of a continuous process chain within E3.series.

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Project Management made easy - DS-E3 StarterPackage

Date: Thursday 4th June 2020 – 16:00 CET
Presenter: Tim Brown

Who doesn’t recognise this? Many versions, many intermediate results, many copies, who has the latest version? Where is it stored? Who is currently working on it? Which settings, structure and database is the right one? We want to answer all these questions in this presentation and present a simple solution that can help you in your daily work with E3.series.

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Cabinet Design with E3.Panel

Date: Tuesday 9th June 2020- 11:00 CET
Presenter:
Tim Brown

The participants learn to work with control cabinet templates in 2D and 3D, to perform quick and easy mass placement of components, to complete terminal strips automatically, to replace standard terminals with multi-level terminals, and to create variants of a control cabinet placement.

Perform automatic control cabinet wiring taking into account voltage levels and wire assignment to signals.

Further topics are output of wiring lists and data packages for Komax wire harnessing machines as well as digitally guided wiring with E3.WiringCockpit and final inspection with E3.WiringCheck.

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Harness Engineering for Manufacturing (New Module E3.FormboardAdvance)

Date: Thursday 25th June 2020 – 11:00 CET
Presenter:
Uwe Schütz

With E3.FormboardAdvance, Zuken Japan lays the foundation for a series of new products for wire harness development in the automotive industry.

The focus is on providing all relevant data for wire harness production and assembly. Cost and weight calculations are part of the functional scope as well as assembly instructions, rule-based part selection and much more.

Uwe Schütz has taken a look at the tool and gives an overview of functions and areas of application.

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CR-8000

EMC for PCB Designers

Date: Thursday 4th June 2020 – 11:00 CET
Presenter:
Ralf Brüning

Poor EMC is one of the main reasons for PCB re-designs. Indeed, an estimated 50% of first-run boards fail because they either emit unwanted EM and/or are susceptible to it.

In this presentation, an EMC minded PCB design approach is presented, allowing designers to understand which EMC rules will apply to PCB projects and how EMC analysis capabilities can be utilized in the CAD flow to reduce the risk of EMC compliance failure once the board is manufactured.

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Constraint specification in CR-8000

Date: Wednesday 10th June 2020 – 11:00 CET
Presenter:
Paul Jones

In Release 2019 of Design Force, the unification of the constraint browsers of Design Gateway and Design Force enabled front-loading of design decisions from layout to engineering.

As a result, hardware designers are able to define topology, clearance rules and various specifications such as designing of differential pairs in a more front-loaded constraint-driven design approach.

In the lecture the use of the Rule Stack Editor and Clearance Class in conjunction with the Constraint Browser will be explained step by step.

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Using an Approved Components List to Avoid Supply Chain Risk

Date: Tuesday 16th June 2020 – 16:00 CET
Presenter:
Vernon Densler, Sr. Product Manager, Silicon Expert

In today’s reality of working remotely within our global community, it is critical that the correct information is consistently available to the correct people within a company at the right time.
This webinar will outline the supply chain challenges we face today and how the collaboration of Zuken and SiliconExpert can bridge the information gaps by providing the best quality component data throughout the entire product lifecycle plan.
Learn how the use of Approved Components Lists and ‘just in time’ data can ensure the best possible component choices resulting in risk mitigation and unplanned cost elimination.

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DS-CR smart working library management

Date: Wednesday 17th June 2020 – 16:00 CET
Presenter:
Brian Morris

How to organise and manage CR libraries to facilitate globally distributed working.

At a time of increased distributed working this webinar shows how DS-CR can be utilised to ensure that CR libraries continue to be managed in order to support models of remote working.

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Advanced IC Packaging and Co-Design Solution with Zuken Design Force

Date: Thursday 18th June – 11:00 CET
Presenter: Iyad Rayane

The demand of consumer electronics and mobile communications devices drives electronics manufacturers to deliver more and more compact and portable devices. Today we request more functionalities, better performance, faster and smaller. All these requirements are driving semiconductor companies to develop new IC packaging technologies to provide greater integration in smaller packages.

The last decade has seen an explosion of new packaging technologies including FOWLP, stacked IC packages and SiP. Designing those packages typically involves three independent design processes – chip, package and PCB – carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment that streamlines the best SiP implementation by considering the system-level impact of each design decision, especially for optimizing. The new co-design approach enables netlist management to follow up design modification including die partitioning and seamless electrical characteristic verification during the design. The end result is higher performance and improved quality for smart systems, MEMS and IoT applications.

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Engineering Requirements of IoT Devices

Date: Wednesday 24th June 2020, 15:00 CET
Presenter: Ralf Brüning

In recent years, the design of Internet of Things (IoT) products became a major topic of interest. But mostly when discussing IoT aspects, the focus is on the software/application and the business-model side, neglecting the fact that printed circuit boards (PCBs) are the core of (nearly) every IoT device, with dedicated requirements for the design and analysis process (e.g. ultra low power, tiny form factors, sensors and actors). All of this will be discussed in the session.

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Practical Signal Integrity and EMI Control

Date: Thursday 3rd Septermber 2020 – 15:00 CET
Presenter: Ralf Brüning

The fast signal switching times of today’s digital systems require particular attention to the signal integrity during design to ensure reliable operation and EMI control.
In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.

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Industry

Profit from the digital twin - is automatic product optimization possible?

Date: Tuesday 9th June 2020 – 15:00 CET
Presenter: Gerald Lobermeier, Head of Strategic Digital Product Management, Weidmüller

This presentation will examine the different aspects of how digital twin data may be used for product development, paving the way for a self-learning product.
We will look at:-

  • How product data leads to information
    During the operation of machines and systems, considerable amounts of data are generated. These can be used by companies on the one hand to develop additional business models (such as industrial analytics). On the other hand, this data has the potential to be used for future product development.
  • Data Acquisition
    Weidmüller investigates the digital twin obtained from operating data of components used at the customer site. The data – together with many more digital twins – is aggregated and analyzed. After that, an abstract of this information is used in the Product Lifecycle System for the requirements management.
  • Outlook – the future
    The next step of the development would be self-learning products: products which could easily adapt to their usage conditions or even improve themselves.

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The Digital Thread, MBSE and PLM - Key Success Factors for Digital Transformation in Today's Engineering

Date: Thursday 25th June 2020 – 14:00 CET
Presenter: Oliver Hechtl

Digital transformation is a megatrend since many years. Concepts like Digital Twin, Digital Thread, PLM and MBSE are key elements of this universe.

Oliver Hechtl, Head of Strategic DM/& I Solutions at Zuken GmbH, took a closer look at the various topics from a practitioner’s point of view.

It turns out that these elements are complementary and, used with measure and purpose, can help to transform the flow of information not only in digital product development and manufacturing but also integrating the servicing of products in the field. The objective is to give a strategic recommendation for today’s IT projects how to make use of existing product capabilities and keep the flexibility to plug-in the best-player of tomorrow.

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English Session Timetable

 03-06-20 – 14:00 CET
Process Chain to mCAD by E3.3DTransformer

04-06-20 – 11:00 CET
EMC for PCB Designers

04-06-20 – 16:00 CET
Project Management made easy – DS-E3 StarterPackage

09-06-20 – 11:00 CET
Cabinet Design with E3.Panel

09-06-20 – 15:00 CET
Profit from the digital twin

10-06-20 – 11:00 CET
Constraint specification in CR-8000

16-06-20 – 16:00 CET
Using an Approved Components List to Avoid Supply Chain Risk

17-06-20 – 16:00 CET 
DS-CR smart working library management

18-06-20 – 11:00 CET
Advanced IC Packaging and Co-Design Solution

24-06-20 – 15:00 CET
Engineering Requirements of IoT Devices

25-06-20 – 11:00 CET
Harness Engineering for Manufacturing

25-06-20 – 14:00 CET
The Digital Thread, MBSE and PLM

03-09-20 – 15:00 CET
Practical Signal Integrity and EMI Control

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