Top 10 Blog Posts of 2020


With 2021 right around the corner, we like to take a look back and see how we did in the last year. We pulled some numbers and looked at what the most popular posts published in 2020 were. As always, we want to give a big shoutout to all of our contributing writers and of course, you the visitor, who make this blog something we continue to be proud of year after year.

We hope you have a happy and safe New Year! Keep in touch – we are excited to show all we have planned for 2021!

10. Simplify Harness Manufacturing with Augmented Reality Solutions Schematic diagram of a wire harness moving into an actual picture of a completed harness

By Sanu Warrier

Assembling a wire harness is a complex process. Zuken, in concert with our customers and partners, is tirelessly working to simplify the harness manufacturing process. As a matter of fact, the common theme in most customer requirements is to reduce the gap between quoting and delivering the project…

9. CR-8000 2020 Supports Electronic Subsystem Design Zuken CR-8000 2020 Release

By Bob Potock

CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool…

8. Meet Our People: Mark, Software Developer

Zuken Staff

By Amy Clements

Meet Mark Mecca. He joined Zuken in 2019, after working in the government, pharmaceutical, and travel industries for more than 20 years. He is a software developer and talented musician who works from his home office in Long Pond, Pennsylvania…

7. Can the Digital Engineering Process Protect Your Product from a Lightning Strike?Wireframe airplane model

By Bob Potock

The Digital Transformation and, in turn, Digital Engineering continues to be a focal point at Zuken. More and more companies are turning to digital processes for their complex product designs. Therefore, we’re developing digital solutions to replace outdated, error-prone document-based processes…

6. Requirements Traceability in an MBSE Environment Female Automotive Engineer Uses Digital Tablet with Augmented Reality for Car Design Analysis

By Chad Jackson

The complexity of electrical and electronic (E/E) systems is accelerating across multiple industries and sectors. Manufacturers are adapting their design and development approaches to meet the changing requirements of advancing electrification…

5. Free Training Comes to the Community Zuken free training

By Sandy Jones

Zuken is happy to announce that new e-Training modules for E3.series and CR-8000 are now available in the Community for all active maintenance customers. This is a big win for our maintenance customers, who will now have free access to all e-Training courses in the Community…

4. Engineering Co-Design Across Domains Engineering Co-Design

By Chad Jackson

Many companies struggle with the rising complexity of today’s smart, connected products. Such products span many engineering domains and require multiple prototyping and testing rounds. The potential for complications and log jams is vast. Still, you can nip them in the bud with the right mix of systems simulation, systems engineering, and engineering co-design across domains…

3. Managing the Digital Thread for Electrical Systems Blue robotic arm

By Chad Jackson

As engineers face increasing complexity across electronics and electrical systems, they need a single set of related data to offer insights into the product’s various processes and functions. Simply stated, they need a digital thread for electrical systems…

2. Giving Thanks for YOU Zuken Thanksgiving

By Amy Clements

It seems that no matter what books or articles I’m reading, no matter what podcasts I’m listening to, there is a recurrent theme–it’s gratitude. We’ve heard the phrase before, “attitude of gratitude.” But when was the last time you really put some thought into what that means? I looked it up for a reminder…

1. Evaluation of System in Package Implementation Options in the Chiplet World System in Package design

By Steve Watt

As chiplet usage increases, chip-level concerns shift into the area of System in Package implementation. Therefore, the System in Package (SiP) must now accommodate electrical performance and cost considerations. A rapid prototyping tool flow that allows the engineering team to make quick assessments of these goals is essential…

Amy Clements
Amy Clements
Director of Marketing Communications
Amy is the Director of Marketing Communications in North America. Her role includes advertising, public relations, event management, social media, and more. She thrives on managing complex projects, especially when there is an opportunity to interact with customers. In her spare time, she and her family enjoy traveling.