Resources by All

Resources by
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Blog Brochure Concise overviews of Zuken's product families and pre-packaged bundles for specific areas

Case Study Examples of successful deployments of Zuken technology in customer specific process landscapes Datasheet Detailed descriptions of Zuken software products Press Release Zuken company news, product announcements, partnerships and new customers Software Downloads of free try-out software and viewing tools Software Evaluation Evaluation Zuken Software Software Order Software Viewer Viewing and redlining tools for Zuken software products Webinar Library of recorded Zuken webinars for replay White Paper Industry issues, required capabilites and solution approaches

Stay on the leading edge of PCB, electrical and data management technologies

8 results found
Z0603-IBM-Research-AI-Hardware-Center-1920x956-1-510x310
  • Press Release
March 24, 2025
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.

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Next-Generation 3D LSI-Semiconductor Mounting Design Technology
  • Press Release
December 06, 2022
Zuken Supports Next-Generation 3D LSI-Semiconductor Mounting Design Technology

Zuken helps to overcome design challenges associated with 3D integration in the pursuit of next-generation semiconductor technologies.

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Z0573-pcb-ribbon-bond-wires-510x310
  • Press Release
December 05, 2022
Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules

Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.

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IC Power Modules - Implementation features with Design Force
  • Webinar
August 18, 2021
IC Power Module Design with CR-8000 Design Force

The typical design flow for a power module is in MCAD, where only structural analysis is possible. Moving to a new design flow using CR-8000 Design Force also allows for electrical analysis too. This webinar will demonstrate the features and benefits of this new design flow.

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CR-8000 R2021
  • Press Release
July 07, 2021
Zuken’s CR-8000 2021 Advances Early Design Analysis and Reuse Functionality

CR-8000 advances system-level PCB design with significant enhancements in analog simulation, SI analysis, and intelligent layout and routing

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how to design a printed circuit board
  • Press Release
June 16, 2020
CR-8000 2020

Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

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FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
Chip Package Board co-design
  • White Paper
October 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Chip-Package-Board Co-Design, Design Force Advanced Packaging
Combine chips and boards in new configurations
how to design a printed circuit board
  • Press Release
July 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Chip-Package-Board Co-Design, DFM Center