architecture to detailed design

Transitioning from Architecture Design to Detailed Design

On-demand webinar

This webinar is Part 3 of a 3 part series covering the systems engineering process of converting product or system requirements into a viable and robust hardware architecture and then moving that architecture directly into detailed design without any manual re-entry.

Architecture design is typically done with a variety of tools including Excel and Visio. Once an architecture is defined using these tools the architecture design must be realized in the detailed design process. That transition today is manual and error prone involving data re-entry.

This webinar demonstrates the seamless transition from architecture design and optimization to detailed design. After a short review of architecture optimization and validation, the design will be moved to detailed design. A functional block diagram becomes a detailed design schematic or schematics. 2D multi-board planning becomes a 2D/3D PCB design ready for detailed placement and routing. Data re-entry is not required.

What you’ll learn:

  • How to easily transition from architecture design to detailed design without any data loss or re-entry
  • Functional block transition to a traditional schematic or schematics
  • 2D multi-board floor planning transitions to a multi-board system

Who should watch:

  • Hardware engineers
  • System architects
  • Design engineers
  • Electronic engineers
  • Product managers
  • Engineering managers

Watch now

Related resources

JOINT3_logo_TN-510x310
  • Press Release
September 04, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

Read now
2025-04-22-10_16_03-Greenshot-510x310
  • Press Release
May 08, 2025
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
Press Release
Z0603-IBM-Research-AI-Hardware-Center-1920x956-1-510x310
  • Press Release
March 24, 2025
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.

Read now
blue-hard-and-soft-510x310
  • Webinar
October 07, 2024
Advanced Electronics Collaboration: Zuken DS-CR and Dassault Systèmes’ 3DEXPERIENCE Platform

Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.

Watch Now