Kardinal Microsystems Joins USA Startup Partner Program

Kardinal Microsystems Joins Zuken USA Startup Partner Program

17 August 2016 – Westford, MA, USA – Kardinal Microsystems has joined Zuken USA’s Startup Partner Program aimed at early to mid-stage companies developing electronic-based products. The new program provides access to state-of-the-art PCB and IC packaging development tools, with special terms designed to accommodate the development needs of an early-stage company.

Based in Burlington, Vermont, Kardinal Microsystems was founded in 2015 to develop a superior solution platform for IoT applications. Pascal Nsame, CEO and Founder, said: “We have extremely ambitious goals that require state-of-the-art design solutions and a partner with a proven history of technological innovation. Zuken USA has the technology we need; particularly in the area of chip/package/board co-design. This partnership is essential for our business to succeed.”

Zuken USA has the technology we need; particularly in the area of chip/package/board co-design. This partnership is essential for our business to succeed.

Pascal Nsame CEO and Founder, Kardinal Microsystems

Kardinal Microsystems has developed “the smallest, fastest, smartest, most efficient IoT data platform solution available in the industry at the device level”.

Early-stage companies gain access to state-of-the-art design tools

Kent McLeroth, President and CEO of Zuken USA, said: “We are committed to working with early and mid-stage companies, such as Kardinal Microsystems. Our Startup Partner Program enabled us to work with Pascal and Kardinal Microsystems as a founding partner to develop a program that would provide them access to Zuken’s CR-8000 development platform while still meeting their startup needs. Helping early stage companies achieve big things is a win-win for everyone.”

Kardinal Microsystems worked closely with Zuken USA on the structure of and terms of the Startup Partner Program, offering insight into the incubation and acceleration phases of early product prototype development.

As part of the program Zuken USA offers CR-8000, the industry’s only 3D, product-centric design solution that offers architecture design, concurrent 3D multi-board support, ECAD/MCAD co-design and chip/package/board co-design. This is followed by training and deployment assistance.

Early-stage companies can request more information about Zuken USA’s Startup Partner Program.

For more information about Kardinal Microsystems, see www.kardinal.co

– ends –

About Kardinal Microsystems

Kardinal designs, develops, manufactures and markets innovative technology platform solutions for IoT applications. Learn more at kardinal.co.

Related stories
  • Webinar
September 14, 2020
EMC for PCB Designers

In this presentation, an EMC minded PCB design approach is presented, allowing designers to understand which EMC rules will apply to PCB projects and how EMC analysis capabilities can be utilized in the CAD flow to reduce the risk of EMC compliance failure once the board is manufactured.

Read now
  • Blog
August 20, 2020
Exploring What’s New in CR-8000 2020

What drives the features that are added or updated in a new release?  The majority of the changes or additions in any Zuken tool release are customer-driven. Our customers provide valuable insight into emerging technologies, process and methodology changes, and the direction in which their EDA needs are taking them. This post focuses on the high points of the CR-8000 2020 release.

Read now
  • Blog
July 07, 2020
Tech-Tip: Creating a Connector Pin Netlist

Checking the pinout of your connectors is an important part of creating your printed circuit board.  Checking your pin connections can save you from a costly re-spin of your circuit board.  This can be done using the Constraint Browser in Design Force.  By default, the Constraint Browser does not show this information.

Read now
  • Webinar
July 06, 2020
Practical Signal Integrity for improved EMI Control in PCB Design

In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.

WATCH NOW