fluid design data and electrical design data management

Data Management and PLM

Menu

Bridge the gap between mechanical, electrical and electronic engineering

With the growing complexity of modern products and machines, it is imperative that all engineering disciplines communicate and coordinate activities early on in the engineering process. Our end-to-end solutions manage libararies, design data and configurations to bridge the traditional gaps between mechanical, electrical and electronic engineering disciplines.

iStock_60025874_XXXLARGE-427x320

We can help you with

One-stop library and design data

Direct integration of libary and data management functionality into electrical and fluid authoring tools. Role based access to validated data and configurations.

Library, materials and design data management

Ensure the adoption of current, validated libraries, design data and BOM information in complex electro-mechanical projects.

Electromechanical BOM

Cross-disciplinary engineering process support through object-oriented integration into PLM and ERP systems.

Our satisfied customers

Related resources

Check our latest webinars, white papers, blog posts and more

e3-splash-screen-2026-20250805-510x310
  • Press Release
septembre 09, 2025
E3.series Release 2026

Zuken a annoncé les détails de la nouvelle version E3.series 2026, qui introduit de puissantes fonctionnalités destinées à optimiser la conception électrique et fluidique, à renforcer la collaboration interdisciplinaire et à accroître de manière significative la productivité en ingénierie.

Read now
JOINT3_logo_TN-510x310
  • Press Release
septembre 04, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

Read now
MA_8981-510x310
  • Press Release
août 22, 2025
Zuken ouvre un nouveau centre de développement pour E3.series

Zuken ouvre un nouveau centre de développement pour E3.series à Neu-Ulm, Allemagne

Read now
Genesys_2025-510x310
  • Press Release
juin 10, 2025
GENESYS Advances Interoperability and Usability in Model-Based Systems Engineering

This latest release of GENESYS 2025 focuses on enhancing model structure, streamlining interoperability between tools, and accelerating the adoption of key industry standards that are vital for designing large-scale mission-critical and enterprise systems.

Read now
2025-04-22-10_16_03-Greenshot-510x310
  • Press Release
mai 08, 2025
Zuken lance le CR-8000 2025 avec un support renforcé par l'IA pour la conception de circuits imprimés à haute vitesse et à haute densité

Explore CR-8000 2025’s latest AI and simulation upgrades for faster, more reliable schematic and layout design—optimized for high-speed, high-density electronics.

Read now
What's New eCadstar 2025
  • Press Release
avril 30, 2025
eCADSTAR 2025:boostez votre conception PCB avec des workflows intelligents et une intégration manufacturing optimisée

Les nouvelles fonctionnalités simplifient la gestion des bibliothèques, améliorent la précision des conceptions à haute vitesse et optimisent la documentation et les processus de fabrication pour pour une performance maximale

Read now

Tell us more about your challenge

While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge. We will come back with our perspective on required capabilities, off- the-shelf solution components and value-added services.
Get in touch