Iyad Rayane is Zuken’s European Technical solutions architect for the 3D-IC/Advanced Packaging and Co-Design Environment, focusing on Zuken’s Co-Design flow and Advanced Packaging solution with CR-8000. He holds an engineer diploma and a Master’s degree in microelectronics from the poly-technical institute in Grenoble, France. He has more than 20 years of experience in the semiconductor field where he worked around 11 years as application engineer at Mentor Graphics for SoC design on advanced process nodes. Prior to Mentor Graphics, he worked as EDA engineer at ST Microelectronics developing RF and mixed signal design flows for big design houses. Iyad started his career in a startup in Grenoble area specialized in the Mems design and modeling. He is author and co-author of many scientific publications in international conferences.