![a PCB design layout with various parameters and settings on the right-hand side, illustrating the process of preparing the design data for export and subsequent simulation. integration capabilities between ECAD and MCAD tools for advanced engineering simulations.](https://www.zuken.com/en/wp-content/uploads/sites/2/2020/07/Screenshot-2019-11-18-21.05.21-1280x620-1-510x310.png)
- Blog
November 19, 2019
Tech Tip: How to export MCAD data from CR-8000 Design Force to enable faster thermal simulation in ANSYS Icepak
This video demonstrates how you can export a STEP file from CR-8000 Design Force including automatically editing your package shape and deformation spec to reduce heat transfer and fluid flow simulation time in ANSYS Icepak.
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![Toshiba – RF Module Shrink (TransferJet™)](https://www.zuken.com/en/wp-content/uploads/sites/2/2019/04/toshiba-embdded-module-featured-img-510x310.jpg)
- Blog
November 13, 2017
Toshiba – RF Module Shrink (TransferJet™)
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm...
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Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phon...