TEWS soon realized that they were able to try different decoupling schemes, layer spacing and power distribution area layout schemes using “what-if” capabilities in a fast and efficient way. As TEWS supplies products to international markets, EMI and EMC compliance are also critical. This requirement was satisfied by using the EMI module within the Power Integrity Advance toolset, using algorithms developed at Missouri University of Science and Technology (formerly the University of Missouri-Rolla), to predict the worst-case emission levels of a PCB. “Even though we did not expect to match chamber measurement with accurate dBs, the ease-of-use and reliability of the results of Power-Integrity Advance EMI, together with its fast analysis, gave us important hints about radiation hot spots on the board well before we produced the first prototype.”