PCB Detroit 2025

June 2-3, 2025 on the campus of Wayne State University

Printed Circuit Engineering Association (PCEA) will host a new technical conference and exhibition in June in Detroit for printed circuit designers, design engineers, fabricators and assemblers.

PCB Detroit will take place June 2-3 on the campus of Wayne State University. It will include two days of paid technical sessions. In addition, on June 2 will be an evening reception featuring industry vendors that will be open to the public.

Wayne State University is Michigan’s third-largest university, and a licensee of the PCEA Training Certified Printed Circuit Designer curriculum.

The conference will feature speakers on controlling noise, using AI in hardware and PCB design, flex and rigid-flex materials and DfM, HDI via design, and PCB cost drivers, among others. A free reception and special designers meetup (registration required) will take place after classes end on June 2 and 3, respectively.

For information on attending, please contact (877) 606-8331 or pcbdetroit@pcea.net.