High density interconnect

Illustration showing how semiconductor packaging shifts from small round wafers to larger rectangular panels, allowing more chips to fit.
  • Blog
September 17, 2025
Engineering the Future: Zuken’s Role in IC Packaging Innovation
cr-8000, Electronic, 2.5D/3DIC Design, Advanced Packaging, CR-8000, Digital Engineering, EDA Tools, High density interconnect, Multi-domain Integration, Organic Interposers, Panel-level Packaging, Semiconductor Packaging, Blog
circuit board
  • Blog
September 16, 2021
5 PCB Industry Trends in 2021
cr-8000, Electronic, PCB Design, Flex PCB Design, High density interconnect, High-speed PCB Design, Internet of Things (IoT), PCB design, Power Integrity, Blog
This post reveals 5 of the most noteworthy PCB industry trends this year and the profound impact they will have for designers and consumers.