Advanced Packaging

Illustration showing how semiconductor packaging shifts from small round wafers to larger rectangular panels, allowing more chips to fit.
  • Blog
September 17, 2025
Engineering the Future: Zuken’s Role in IC Packaging Innovation
cr-8000, Electronic, 2.5D/3DIC Design, Advanced Packaging, CR-8000, Digital Engineering, EDA Tools, High density interconnect, Multi-domain Integration, Organic Interposers, Panel-level Packaging, Semiconductor Packaging, Blog
Multi-board system-level design including mechanical data. Advanced packaging design Zuk
  • Blog
May 26, 2021
Advanced Packaging Design Processes for Modern Technology Challenges
cr-8000, Electronic, PCB Design, System-level Design, Advanced Packaging, CR-8000, CR-8000 Design Force, Blog
Advanced Packaging design is evolving to meet modern design challenges. Visit Zuken at ECTC to see our innovative tools and processes to address those...
avoiding-ddr4-layout-problems-featured-img-1280x620
  • Blog
June 26, 2020
A Few Thoughts on Avoiding DDR4 Layout Problems
PCB Design, Advanced Packaging, CR-8000, CR-8000 Design Force, Electronic, High-speed PCB Design, IC Packaging Design, Verification and Validation, Blog