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Additional CR-8000 resources

- Comunicato Stampa
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

- Comunicato Stampa
Explore CR-8000 2025’s latest AI and simulation upgrades for faster, more reliable schematic and layout design—optimized for high-speed, high-density electronics.

- Comunicato Stampa
Zuken si è unita all'IBM Research AI Hardware Center per sviluppare soluzioni avanzate nel packaging 3DIC, nell'accelerazione hardware per l'AI e nell'ottimizzazione dei workflow EDA. La collaborazione si concentra sull'integrazione eterogenea dei chip, sulla valutazione degli acceleratori per deep learning, sullo sviluppo di materiali innovativi e sui test di affidabilità. Questa partnership evidenzia l'impegno di Zuken nell'innovazione nella progettazione di chip basata sull'intelligenza artificiale e nelle soluzioni di packaging per semiconduttori di nuova generazione.

- Webinar
CR-8000 Webinar: Zuken recently announced the upcoming release of the industry’s first AI-based PCB place and route product - Autonomous Intelligent Place and Route (AIPR) - This webinar will examine how companies and users will benefit.

- Webinar
Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.

- Webinar
In this Webinar, you will discover how to streamline your PCB design process with CR-8000, and seamlessly integrate prototype testing results using NoiseKen for enhanced accuracy and performance.