Digital Twin, Digital Thread, PLM and MBSE - the buzzwords are following each other in ever faster succession, making it difficult to keep an overview. Oliver Hechtl, Head of Strategic DM/& I Solutions at Zuken GmbH, took a closer look at the various topics from a practitioner's point of view to bring some order to the web of topics.

Part of the Smart Cabinet Building partnership, this webinar we will show you the modular approach of the Wire Process Center from Weidmüller.

In this webinar we will demonstrate the possibilities of E3.WiringChecks based on a concrete and consistent application example.

In this webinar we will show you with the Klippon® Automated RailAssembler an economic solution for the assembly of mounting rails and with the Klippon® Automated RailLaser the next level of fully automatic marking of mounting rails, which allows time savings of up to 90%.

Today's discussions about the digital twin are mainly focused on the areas engineering and production. What is often overlooked is on-site maintenance and customer service.

In this webinar we will discuss and show how customers are implementing the Smart Cabinet Building solutions - saving them both time and costs.

The new labeling solution from Komax integrates a thermal transfer printer for shrink sleeves directly into the automated wire production process.

Opening new opportunities through digitization in control cabinet manufacturing with customized, integrated solutions,The SMART CABINET BUILDING initiative brings together Weidmüller, Komax, Zuken, and Armbruster Engineering - This webinar will show you a complete user journey.

This webinar will discuss the challenges and best practices of creating a MBSE model for the purpose of wire harness and Electronic Control Units (ECU’s) implementation.

In this presentation, an EMC minded PCB design approach is presented, allowing designers to understand which EMC rules will apply to PCB projects and how EMC analysis capabilities can be utilized in the CAD flow to reduce the risk of EMC compliance failure once the board is manufactured.