Zuken Expericence Day - Dresden

Join us for a day to get a free-of-charge hands-on experience and overview of CR-8000 Advanced Packaging.

A Zuken expert will provide you with an overview / training in English language using our Zuken solution supporting Advanced SiP design and synthesize Flip Chip design with Co-design.

Content included within this workshop:

• New design methodology for SiP
• Support for wizards and parametric creation of IC’s, BGA package, and 3D wire-bond placement
• Seamless connection of stacking IC’s and package on package (PoP)
• Package-specific design rules with real-time 3D checks and view
• Flip Chip I/O bump optimization
• I/O ring synthesis capability guarantees package routability
• “Tile-based” die bump placement and optimization
• Tape-out quality automatic routing for chip RDL and package escape routing

*Please note: The workshops do not replace the comprehensive training courses for users offered as part of Zuken’s consulting, training and support offerings.

For details of alternative CR-8000 Experience Days, visit our web page: zuken.com/zed-cr

Ansprechpartner für Fragen

Bei Fragen steht Ihnen die Veranstaltungsleiterin Tara Osborne gerne zur Verfügung:

Email : tara.osborne@zuken.com