Zuken Expericence Day - Dresden

Join us for a day to get a free-of-charge hands-on experience and overview of CR-8000 Advanced Packaging.

A Zuken expert will provide you with an overview / training in English language using our Zuken solution supporting Advanced SiP design and synthesize Flip Chip design with Co-design.

Content included within this workshop:

  • New design methodology for SiP
  • Support for wizards and parametric creation of IC’s, BGA package, and 3D wire-bond placement
  • Seamless connection of stacking IC’s and package on package (PoP)
  • Package-specific design rules with real-time 3D checks and view
  • Flip Chip I/O bump optimization
  • I/O ring synthesis capability guarantees package routability
  • “Tile-based” die bump placement and optimization
  • Tape-out quality automatic routing for chip RDL and package escape routing

*Please note: The workshops do not replace the comprehensive training courses for users offered as part of Zuken’s consulting, training and support offerings.

For details of alternative CR-8000 Experience Days, visit our web page: zuken.com/zed-cr

Ansprechpartner für Fragen

Bei Fragen steht Ihnen die Veranstaltungsleiterin Tara Osborne gerne zur Verfügung:

Email : tara.osborne@zuken.com

Registration

Die Teilnahme am Tag ist kostenlos, aber die Plätze sind begrenzt.

Registrieren Sie sich jetzt und füllen Sie das Formular auf der Seite aus, um Ihre Anwesenheit zu bestätigen!