Today's discussions about the digital twin are mainly focused on the areas engineering and production. What is often overlooked is on-site maintenance and customer service.

In this webinar we will discuss and show how customers are implementing the Smart Cabinet Building solutions - saving them both time and costs.

The new labeling solution from Komax integrates a thermal transfer printer for shrink sleeves directly into the automated wire production process.

Paperless engineering improves accuracy, traceability, and schedule.  Communication gaps riddle engineering companies, and E3.series tools E3.WiringChecks and E3.WiringCockpit is here to facilitate communication between design, checking, commissioning, technicians, and all parties involved after the initial design. 

Opening new opportunities through digitization in control cabinet manufacturing with customized, integrated solutions,The SMART CABINET BUILDING initiative brings together Weidmüller, Komax, Zuken, and Armbruster Engineering - This webinar will show you a complete user journey.

This webinar will discuss the challenges and best practices of creating a MBSE model for the purpose of wire harness and Electronic Control Units (ECU’s) implementation.

In this presentation, an EMC minded PCB design approach is presented, allowing designers to understand which EMC rules will apply to PCB projects and how EMC analysis capabilities can be utilized in the CAD flow to reduce the risk of EMC compliance failure once the board is manufactured.

Who doesn’t recognise this? Many versions, many intermediate results, many copies, who has the latest version? Where is it stored? Who is currently working on it? Which settings, structure and database is the right one? We want to answer all these questions in this presentation.

This webinar explains the interconnection of electrical and mechanical designs. E3.3DTransformer is a versatile tool for all existing CAD systems and offers an easy-to-use UI with quick setup time along with a light-weight and user-friendly application for transforming 3D MCAD data into a comprehensive E/E topology model.

In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.