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Resta aggiornato sulle tecnologie PCB, elettriche e di gestione dei dati

269 risultato trovato
E3.HarnessAnalyzer Interactive Demo
  • Software Evaluation
Settembre 10, 2025
E3.HarnessAnalyzer Interactive Demonstration

E3.HarnessAnalyzer is a powerful tool for viewing and analyzing wire harness drawings in the HCV container data format.

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Watch as 25+ movies guide you through the E3.HarnessAnalyzer functionality
Extract ECAD design data from MCAD designs
  • Software Evaluation
Settembre 10, 2025
E3.3DTransformer Demo

E3.3DTransformer is designed to convert 3D MCAD models into electrical designs, offering an interactive demonstration and tutorial upon registration.

Interactive Tour
Take the 10 minute interactive evaluation
e3-splash-screen-2026-20250805-510x310
  • Comunicato Stampa
Settembre 09, 2025
E3.series Release 2026

Zuken annuncia le novità della release E3.series 2026, che introduce potenti funzionalità per ottimizzare la progettazione elettrica e fluidica, rafforzare la collaborazione interdisciplinare e incrementare in modo significativo la produttività ingegneristica.

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JOINT3_logo_TN-510x310
  • Comunicato Stampa
Settembre 04, 2025
Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

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zuken_CorporateProfile-2025-510x310
  • Brochure
Agosto 26, 2025
Corporate Profile Report 2025

Our strategy, solutions, financial performance, and customer success stories showcase how Zuken is shaping the future of engineering. The report combines key financial highlights with insights into how leading organizations are using our technologies to accelerate innovation.

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Management Report and Vision - Zuken Inc, Yokohama
MA_8981-510x310
  • Comunicato Stampa
Agosto 22, 2025
Zuken apre un nuovo centro di sviluppo per E3.series

Zuken apre un nuovo centro di sviluppo per E3.series a Neu-Ulm

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Genesys_2025-510x310
  • Comunicato Stampa
Giugno 10, 2025
GENESYS Advances Interoperability and Usability in Model-Based Systems Engineering

This latest release of GENESYS 2025 focuses on enhancing model structure, streamlining interoperability between tools, and accelerating the adoption of key industry standards that are vital for designing large-scale mission-critical and enterprise systems.

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2025-04-22-10_16_03-Greenshot-510x310
  • Comunicato Stampa
Maggio 08, 2025
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design

Explore CR-8000 2025’s latest AI and simulation upgrades for faster, more reliable schematic and layout design—optimized for high-speed, high-density electronics.

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What's New eCadstar 2025
  • Comunicato Stampa
Aprile 30, 2025
eCADSTAR 2025 migliora la progettazione PCB con workflow smart e integrazione produttiva

Le nuove funzionalità semplificano la gestione delle librerie, aumentano la precisione nei progetti “high speed” e ottimizzano la documentazione e i processi produttivi, per una maggiore efficienza.

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Z0603-IBM-Research-AI-Hardware-Center-3-510x310
  • Comunicato Stampa
Marzo 24, 2025
Zuken entra a far parte dell’IBM Research AI Hardware Center per sviluppare soluzioni hardware di nuova generazione per l’intelligenza artificiale

Zuken si è unita all'IBM Research AI Hardware Center per sviluppare soluzioni avanzate nel packaging 3DIC, nell'accelerazione hardware per l'AI e nell'ottimizzazione dei workflow EDA. La collaborazione si concentra sull'integrazione eterogenea dei chip, sulla valutazione degli acceleratori per deep learning, sullo sviluppo di materiali innovativi e sui test di affidabilità. Questa partnership evidenzia l'impegno di Zuken nell'innovazione nella progettazione di chip basata sull'intelligenza artificiale e nelle soluzioni di packaging per semiconduttori di nuova generazione.

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AI Based PCB Place and Route
  • Webinar
Marzo 21, 2025
AI-Based PCB Place and Route

CR-8000 Webinar: Zuken recently announced the upcoming release of the industry’s first AI-based PCB place and route product - Autonomous Intelligent Place and Route (AIPR) - This webinar will examine how companies and users will benefit.

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mbse-data-process-1024x576-1-510x310
  • White Paper
Febbraio 25, 2025
How to Leverage MBSE to Solve Critical Challenges in Discrete Manufacturing

This white paper introduces a solution that combines the innovative approach of Model-Based Systems Engineering (MBSE) with the best practice of managing data and processes in a PDM system.

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wire-harness-1600x500-1-510x310
  • Webinar
Febbraio 17, 2025
ECAD/MCAD Integration for Efficient Harness Design

Explore how Zuken’s E3.series integrates seamlessly with leading MCAD tools like Siemens' NX and Solid Edge, Dassault's CATIA V5 / V6 and SolidWorks, PTC’s Creo, and Autodesk’s Inventor for efficient harness design - includes a detailed demonstration of how Siemens NX can be integrated with E3.series.

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E3.ReportGenerator
  • Webinar
Gennaio 30, 2025
E3.series Report Generator
Webinar, E3.ReportGenerator
genesys-2024-zuken-vitech-510x271
  • Comunicato Stampa
Gennaio 08, 2025
Zuken Vitech Unveils GENESYS 2024: Accelerating Systems Engineering with Advanced Capabilities
Comunicato Stampa
Zuken Corporate Profile 2024
  • Brochure
Novembre 04, 2024
Corporate Profile Report 2024

Download the latest Zuken Corporate Profile including statements from the Board and financial highlights.

DOWNLOAD
Management Report and Vision - Zuken Inc, Yokohama