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42 results found
panasonic-4k-tablet_350x262px
  • White Paper
octobre 20, 2018
Designing Products, Not Just Boards
White Paper, Design Force
The benefits of product-centric design and how it differs from current-generation PCB-centric processes and tools.
CR-8000 System Planner - All visionaries
  • White Paper
octobre 20, 2018
End-to-end hardware architecture design and validation
White Paper, System Planner
A new approach to creating design architectures
Chip Package Board
  • White Paper
octobre 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Programmable Logic
Combine chips and boards in new configurations
iot-modular-912-510x310
  • White Paper
octobre 12, 2018
The Internet of Things and Modular Design
White Paper, CR-8000
How the rise of IoT can lead to changes in the design process
KRONE integrates ECAD, MCAD and ERP to enable integrated design and sourcing
  • Case Study
octobre 10, 2018
Krone
Case Study, Krone, Contrôle de la qualité par l’automatisation et la vérification, Digital Twin, Wire Harness Engineering, ECAD/MCAD Integration, Special Vehicles, Industry 4.0, Electrical Planning and Documentation
Krone Agricultural Machinery integrates ECAD, MCAD and ERP to enable integrated design and sourcing
endress-hauser-production-550x342-510x310
  • Case Study
octobre 01, 2018
Endress+Hauser
Case Study, Endress+Hauser, Design Force, Augmenter la productivité, Construction modulaire, Machines, Restructuration du processus de développement de produits
Endress+Hauser standardizes PCB engineering and production processes for industrial measurement products across distributed locations
toshiba-transfer-jet-813x492-510x310
  • Case Study
septembre 26, 2018
Toshiba
Case Study, Toshiba, PCB Design in Context, Verification and Validation, Multi-disciplinary collaboration
significantly reduce product size with 3D chip, package, board co-design.
new-TCC-unit-510x310
  • Case Study
juin 25, 2017
BAE Systems
Case Study, BAE Systems
BAE Systems uses CADSTAR to help reduce turret control computer wiring by 98%
tam640_bare_board2-optimized-510x310
  • Case Study
novembre 22, 2014
TEWS
Case Study, TEWS
TEWS significantly reduces development time and cost of complex high-speed PCBs using concurrent power integrity simulation.
panalytical-1280x630-510x310
  • Case Study
avril 25, 2011
Malvern Panalytical
Case Study, Malvern Panalytical
enhance data collaboration between ECAD and MCAD, improving manufacturing data.