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Stay on the leading edge of PCB, electrical and data management technologies

3 results found
  • Press Release
décembre 06, 2022
Zuken contribue à la conception de la prochaine génération de technologies de montage LSI-Semiconducteur en 3D

Zuken helps to overcome design challenges associated with 3D integration in the pursuit of next-generation semiconductor technologies.

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  • Webinar
novembre 28, 2018
I/O Optimization with 3D SoC, SiP, and PCB co-design
Webinar, Conception conjointe de puce, empaquetage et carte, Design Force
  • Press Release
juillet 11, 2018
CR-8000 2018 Boosts Process Efficiency
Press Release, Design Gateway, Design Force, Conception conjointe de puce, empaquetage et carte, DFM Center